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NLV14051BDR2G

Onsemi

NLV14051BDR2G by Onsemi

NLV14051BDR2G by Onsemi is a CMOS single-ended multiplexer with 8 channels. It operates b/w -55 to 125 °C and has a max on-state resistance of 1200 ohm. Suitable for military-grade applications, it features a small outline package style and matte tin terminal finish.

Median Price

$0.504

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,338 parts In-Stock

1+ parts

$0.630

100+ parts

$0.347

1k+ parts

$0.302

10k+ parts

$0.277

4,338

$0.630

$0.347

$0.302

$0.277

Mouser Electronics

USA . 1,491 parts In-Stock

1+ parts

$0.630

100+ parts

$0.348

1k+ parts

$0.303

10k+ parts

$0.284

1,491

$0.630

$0.348

$0.303

$0.284

Rochester

USA . 4,567 parts In-Stock

1+ parts

-

100+ parts

$0.336

1k+ parts

$0.279

10k+ parts

$0.248

4,567

-

$0.336

$0.279

$0.248

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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$0.378

10k+ parts

$0.310

2,500

-

-

$0.378

$0.310

Distributors (In-Stock)

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Digiode

USA . 2,471 parts In-Stock

1+ parts

$0.261

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2,471

$0.261

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Vyrian

USA . 2,310 parts In-Stock

1+ parts

$0.275

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2,310

$0.275

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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2,500

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ComSIT USA

USA . 2,500 parts In-Stock

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2,500

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Bristol Electronics

USA . 2,230 parts In-Stock

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2,230

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Distributors (Availability)

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Corphita

USA . 660 parts In-Stock

1+ parts

$0.248

100+ parts

-

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660

$0.248

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Corohmni

South Africa . 69 parts In-Stock

1+ parts

$0.275

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69

$0.275

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Vigor

Singapore . 126 parts In-Stock

1+ parts

$0.290

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126

$0.290

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Microchip USA

USA . 2,622 parts In-Stock

1+ parts

$5.070

100+ parts

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2,622

$5.070

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

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90,000

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GreenTree Electronics

Israel . 37,500 parts In-Stock

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Eastek

USA . 32,500 parts In-Stock

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32,500

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Metaverse IC Inc.

Canada . 30,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,692 parts In-Stock

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23,692

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Perfect Parts

USA . 20,910 parts In-Stock

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20,910

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Problanco Electronics

Mexico . 6,532 parts In-Stock

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6,532

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TANS Electronics

Latvia . 6,480 parts In-Stock

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6,480

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Kepictronics

USA . 3,000 parts In-Stock

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Kulean Microsystems

USA . 2,042 parts In-Stock

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2,042

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UHIMA Technologies

Türkiye . 422 parts In-Stock

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422

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SupplyDigital Components

Austria . 82 parts In-Stock

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82

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Overview

Enhance your electronic designs with the NLV14051BDR2G by Onsemi, a top-tier manufacturer known for quality and reliability. This multiplexer offers 8 channels of seamless switching, making it ideal for a wide range of applications in the electronics industry. With its military-grade temperature grade and small outline package style, this versatile component ensures optimal performance in extreme conditions. Trust Onsemi to deliver cutting-edge technology that exceeds expectations, providing value and benefits that set your projects apart. Elevate your designs with the NLV14051BDR2G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to external elements, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Power Supplies (V): 5/15

Support for 5V and 15V power supplies offers versatility in different electronic systems, making this multiplexer suitable for a wide range of applications.

No. of Terminals: 16

Having 16 terminals allows for efficient connectivity and signal routing in complex electronic circuits, making this multiplexer a versatile solution for various setups.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring reliable performance and energy efficiency in the operation of this multiplexer.

Technical Specifications

Multiplexers & Switches NLV14051BDR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Maximum On-state Resistance (Ron):

1200 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NLV14051BDR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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