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NLV14016BDR2G

Onsemi

NLV14016BDR2G by Onsemi

NLV14016BDR2G by Onsemi is a CMOS SPST multiplexer with 4 functions, operating at -55 to 125 °C. It has a max on-state resistance of 840 ohm and operates on power supplies of 5/15V. This small outline package with matte tin finish is ideal for military-grade applications requiring separate outputs.

Median Price

$0.460

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,771 parts In-Stock

1+ parts

$0.460

100+ parts

$0.248

1k+ parts

$0.211

10k+ parts

$0.195

1,771

$0.460

$0.248

$0.211

$0.195

Mouser Electronics

USA . 1,334 parts In-Stock

1+ parts

$0.460

100+ parts

$0.249

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$0.212

10k+ parts

$0.200

1,334

$0.460

$0.249

$0.212

$0.200

Distributors (In-Stock)

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Digiode

USA . 2,267 parts In-Stock

1+ parts

$0.922

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2,267

$0.922

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Vyrian

USA . 485 parts In-Stock

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$0.970

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485

$0.970

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Flip Electronics

USA . 5,000 parts In-Stock

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Vigor

Singapore . 192 parts In-Stock

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$0.230

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192

$0.230

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Corphita

USA . 463 parts In-Stock

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$0.873

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463

$0.873

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Corohmni

South Africa . 199 parts In-Stock

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$0.980

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199

$0.980

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Component Stockers USA

USA . 13,947 parts In-Stock

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$2.000

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$2.000

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TANS Electronics

Latvia . 6,105 parts In-Stock

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Kulean Microsystems

USA . 5,782 parts In-Stock

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Problanco Electronics

Mexico . 5,141 parts In-Stock

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iodParts Technologies Inc.

India . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,773 parts In-Stock

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UHIMA Technologies

Türkiye . 651 parts In-Stock

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Overview

Discover the superior quality and reliability of the NLV14016BDR2G by Onsemi, a top-tier manufacturer in the industry. This multiplexer & switch offers unparalleled performance and precision for a wide range of applications. With its innovative technology and military-grade temperature grade, this product ensures optimal functionality even in the most demanding environments. Experience seamless operation and enhanced efficiency with the NLV14016BDR2G, providing customers with exceptional value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection to the internal components of the multiplexer, ensuring long-term reliability.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and simplifying the assembly process.

No. of Functions: 4

With multiple functions available in one device, this multiplexer offers versatility and efficiency in handling different signals.

Power Supplies (V): 5/15

Support for both 5V and 15V power supplies makes this multiplexer compatible with a wide range of electronic systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance even under demanding environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the multiplexer suitable for various applications.

Technical Specifications

Multiplexers & Switches NLV14016BDR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Functions:

4

No. of Terminals:

14

Maximum On-state Resistance (Ron):

840 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NLV14016BDR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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