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NLV14066BDG

Onsemi

NLV14066BDG by Onsemi

NLV14066BDG by Onsemi is a CMOS multiplexer with 4 functions, operating at temperatures from -55 to 125 °C. It has a max on-state resistance of 1200 ohm and separate output voltage of 5/15V. This small outline IC in plastic/epoxy package is ideal for military-grade applications requiring SPST switches.

Median Price

$0.251

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,005 parts In-Stock

1+ parts

-

100+ parts

$0.271

1k+ parts

$0.225

10k+ parts

$0.200

6,005

-

$0.271

$0.225

$0.200

Farnell

UK . 6,005 parts In-Stock

1+ parts

-

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$0.176

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$0.176

DigiKey

USA . 6,005 parts In-Stock

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$0.240

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$0.240

Verical

USA . 5,885 parts In-Stock

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$0.262

5,885

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$0.262

Flip Electronics (Authorized)

USA . 1,554 parts In-Stock

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1,554

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Distributors (In-Stock)

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Vyrian

USA . 1,866 parts In-Stock

1+ parts

$0.176

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1,866

$0.176

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Digiode

USA . 1,250 parts In-Stock

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$0.221

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1,250

$0.221

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Flip Electronics

USA . 1,554 parts In-Stock

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1,554

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Distributors (Availability)

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Corohmni

South Africa . 172 parts In-Stock

1+ parts

$0.176

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172

$0.176

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Corphita

USA . 2,026 parts In-Stock

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$0.210

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2,026

$0.210

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Vigor

Singapore . 571 parts In-Stock

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$0.220

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571

$0.220

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SupplyDigital Components

Austria . 8,249 parts In-Stock

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Continental Prestige Electronics

USA . 6,005 parts In-Stock

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$0.168

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$0.168

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Kulean Microsystems

USA . 5,435 parts In-Stock

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5,435

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Problanco Electronics

Mexico . 5,272 parts In-Stock

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Kepictronics

USA . 4,005 parts In-Stock

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TANS Electronics

Latvia . 2,246 parts In-Stock

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2,246

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UHIMA Technologies

Türkiye . 554 parts In-Stock

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554

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Microchip USA

USA . 246 parts In-Stock

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246

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Overview

Experience unparalleled quality and reliability with the NLV14066BDG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge multiplexers & switches that are perfect for a wide range of applications. From military-grade technology to separate outputs, this product offers exceptional performance and versatility. Trust Onsemi to provide you with top-notch products that exceed your expectations and take your projects to the next level. Choose the NLV14066BDG for superior value, benefits, and advantages that will set you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, making the product long-lasting.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards, saving time and effort.

No. of Functions: 4

Offers flexibility and versatility in routing signals and managing data.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without malfunctioning, ensuring reliable performance.

Terminal Finish: MATTE TIN

Provides good conductivity and corrosion resistance, improving the overall performance of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Multiplexers & Switches NLV14066BDG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Functions:

4

No. of Terminals:

14

Maximum On-state Resistance (Ron):

1200 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NLV14066BDG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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