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CD74HC4051M

Texas Instruments

CD74HC4051M by Texas Instruments

CD74HC4051M by Texas Instruments is a single-ended multiplexer with 1 channel. It has a max operating temperature of 125°C and a min operating temperature of -55°C. This IC is commonly used in applications requiring signal switching and multiplexing.

Median Price

$1.230

Lifecycle Status

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Digiode

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Component Stockers USA

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IDEA Electronic Components Group

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Overview

Introducing the CD74HC4051M by Texas Instruments, a high-quality multiplexer and switch that offers incredible value and benefits to customers. Manufactured by Texas Instruments, a trusted name in the industry, this product ensures reliability and performance. With its small outline package style and dual terminal position, it is perfect for various applications. Whether you need to multiplex signals or switch between different channels, the CD74HC4051M delivers with its maximum on-state resistance of 270 ohms and fast switching times of 32 ns. Experience the advantages of this versatile device and unlock new possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental conditions, making the product suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the multiplexers and switches onto printed circuit boards, saving time and effort during assembly.

No. of Functions: 1

With a single function, this product simplifies circuit design and reduces complexity, making it ideal for straightforward applications.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with common board layouts and facilitates efficient utilization of space on the PCB.

Nominal Supply Voltage (Vsup): 4.5 V

This nominal supply voltage ensures compatibility with a wide range of power sources, increasing the versatility of the product for different system requirements.

Power Supplies (V): 2/6, GND/-6

The multiple power supply options allow flexible integration into systems operating with either 2 or 6 volts, accommodating different voltage requirements.

No. of Terminals: 16

The abundance of terminals provides ample connectivity options, enabling the multiplexers and switches to interface with multiple input and output devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable board space and enables high-density circuitry, making this product suitable for compact designs.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliable performance and stability even in demanding environments.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product remains functional in extremely cold conditions, expanding its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides strong solder joints, excellent conductivity, and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positions enhance flexibility during board layout and enable efficient routing of signals, contributing to smoother circuit designs.

Output (V): COMMON OUTPUT

The common output allows multiple inputs to share a single output, simplifying circuit connections and enabling efficient data transmission.

Maximum Seated Height: 1.58 mm

The low seated height facilitates proper placement and compatibility with low-profile applications, optimizing space utilization in compact systems.

Width (mm): 3.91 mm

The compact width dimension allows for easy integration into tight spaces and ensures compatibility with smaller PCB designs.

Other IC type: SINGLE-ENDED MULTIPLEXER

This single-ended multiplexer provides a cost-effective and efficient solution for connecting multiple inputs to a single output, simplifying circuit design.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement allows for compatibility with lower power systems and extends the product's usability in various applications.

Minimum Negative Supply Voltage (Vsup): 0 V

The absence of a negative supply voltage requirement simplifies power supply design and reduces overall system cost.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the product can withstand high reflow temperatures during the manufacturing process, increasing its reliability and longevity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables efficient soldering processes, ensuring reliable connections during assembly.

Maximum On-state Resistance (Ron): 270 ohm

The maximum on-state resistance value ensures minimal losses and signal distortion, resulting in efficient signal transmission and high-quality performance.

Maximum Switch-on Time: 32 ns

With a short switch-on time, this product enables fast switching operations, reducing latency and optimizing system response times.

Length: 9.9 mm

The compact length dimension allows for efficient use of space on the PCB, making this product suitable for designs with limited board real estate.

Maximum Switch-off Time: 32 ns

The short switch-off time ensures quick disconnection of signals, enhancing system efficiency and reducing potential interference.

Temperature Grade: MILITARY

The military-grade temperature rating guarantees reliable operation across a wide temperature range, making this product suitable for rugged and demanding environments.

Maximum Supply Current (Isup): 0.08 mA

With a low maximum supply current, this product minimizes power consumption, making it suitable for energy-efficient applications.

No. of Channels: 1

With a single channel, this product simplifies signal routing and reduces complexity, making it ideal for applications requiring a straightforward connection.

Technology: CMOS

The CMOS technology ensures low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the versatility of this product.

Nominal Bandwidth: 200 kHz

The wide nominal bandwidth enables the transmission of high-frequency signals, making this product suitable for applications requiring fast data rates.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure attachment to the PCB, ensuring reliable connections during assembly and operation.

Maximum Negative Supply Voltage (Vsup): -6 V

The high negative supply voltage capability allows for compatibility with systems requiring a wide voltage range, expanding the product's application versatility.

Nominal Negative Supply Voltage (Vsup): -4.5 V

The nominal negative supply voltage ensures compatibility with negative voltage sources, enabling the proper functioning of the multiplexers and switches.

Terminal Pitch: 1.27 mm

The standard terminal pitch simplifies the design, assembly, and connection of the product to the PCB, ensuring compatibility with commonly available components.

Moisture Sensitivity Level (MSL): 1

With an MSL level of 1, this product has a long shelf life and can be stored and handled under normal atmospheric conditions, ensuring reliability and usability.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage rating ensures compatibility with various power sources, accommodating different voltage requirements.

Maximum Signal Current: 0.025 A

With the ability to handle high signal currents, this product allows for the transmission of robust and reliable electrical signals in demanding applications.

Normal Position (V): NC

The normal position being NC (non-conducting) ensures that the switch remains open in its resting state, providing a default state of isolation for the connected devices.

Nominal Off-state Isolation: 73 dB

The high nominal off-state isolation value ensures accurate signal isolation, minimizing cross-talk and maximizing system performance.

Minimum Input Voltage: 0 V

The ability to handle zero input voltage ensures compatibility with various signaling schemes and enhances the product's versatility.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching mechanism ensures a brief interruption between signal paths, preventing potential short circuits and maintaining signal integrity.

Nominal On-state Resistance Match: 5 ohm

The low nominal on-state resistance match ensures minimal signal loss and accurate signal transmission, maintaining high-quality performance.

Maximum Input Voltage: 6 V

The high maximum input voltage rating allows for compatibility with systems operating at different voltage levels, increasing the versatility of the product.

Technical Specifications

Multiplexers & Switches CD74HC4051M attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 2V TO 10V (VCC-VEE) SUPPLY

Other IC type:

Nominal Bandwidth:

200 kHz

Maximum Input Voltage:

6 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-4.5 V

Normal Position (V):

NC

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

73 dB

Nominal On-state Resistance Match:

5 ohm

Maximum On-state Resistance (Ron):

270 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

COMMON OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6,GND/-6

Qualification:

Not Qualified

Maximum Seated Height:

1.58 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

32 ns

Maximum Switch-on Time:

32 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.91 mm

Trade Compliance

CD74HC4051M Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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