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NLV14053BDG

Onsemi

NLV14053BDG by Onsemi

NLV14053BDG by Onsemi is a CMOS SPDT multiplexer with 3 functions, operating at -55 to 125 °C. It has 16 terminals, matte tin finish, and supports 5/15V power supplies. Ideal for military-grade applications requiring small outline packages and low on-state resistance of 1200 ohm.

Median Price

$0.430

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 288 parts In-Stock

1+ parts

$0.430

100+ parts

$0.420

1k+ parts

$0.410

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288

$0.430

$0.420

$0.410

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Distributors (In-Stock)

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Vyrian

USA . 8,603 parts In-Stock

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8,603

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Digiode

USA . 604 parts In-Stock

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604

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Distributors (Availability)

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Vigor

Singapore . 142 parts In-Stock

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$0.440

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142

$0.440

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AZTECH Wire

Italy . 648 parts In-Stock

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$21.370

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648

$21.370

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Component Stockers USA

USA . 429 parts In-Stock

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$99.990

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429

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 28,552 parts In-Stock

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Microchip USA

USA . 7,322 parts In-Stock

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Kulean Microsystems

USA . 7,231 parts In-Stock

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7,231

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SupplyDigital Components

Austria . 5,958 parts In-Stock

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5,958

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 3,452 parts In-Stock

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3,452

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TANS Electronics

Latvia . 2,161 parts In-Stock

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Corphita

USA . 1,002 parts In-Stock

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UHIMA Technologies

Türkiye . 303 parts In-Stock

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Corohmni

South Africa . 277 parts In-Stock

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Overview

Enhance your electronic designs with the NLV14053BDG by Onsemi, a versatile multiplexer and switch that offers superior performance and reliability. Manufactured by industry leader Onsemi, this product is designed to meet the highest quality standards. Ideal for a wide range of applications, this compact device provides customers with seamless functionality and enhanced flexibility in their projects. Experience the value and benefits of the NLV14053BDG today and take your designs to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the multiplexer, ensuring longer lifespan and reliability.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

No. of Functions: 3

With 3 functions, this multiplexer offers versatility and flexibility in routing and switching signals for various applications.

Power Supplies (V): 5/15

Support for multiple power supply voltages (5/15V) allows for compatibility with different system requirements.

No. of Terminals: 16

The high number of terminals (16) provides ample connectivity options for interfacing with other components and devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this multiplexer can withstand harsh environmental conditions and operate reliably in demanding situations.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures that the multiplexer remains functional even in extremely cold environments.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish provides good electrical conductivity and corrosion resistance, enhancing the overall performance and longevity of the multiplexer.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this multiplexer energy-efficient and reliable for signal processing.

Technical Specifications

Multiplexers & Switches NLV14053BDG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Maximum On-state Resistance (Ron):

1200 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NLV14053BDG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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