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NLV14066BCP

Onsemi

NLV14066BCP by Onsemi

NLV14066BCP by Onsemi is a CMOS SPST multiplexer with 4 functions. It operates b/w -55 to 125 °C, suitable for military-grade applications. With a max on-state resistance of 1200 ohm and separate output, it offers reliable performance in various electronic systems.

Median Price

$0.110

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,750 parts In-Stock

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$0.110

2,750

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$0.110

Distributors (In-Stock)

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Digiode

USA . 1,373 parts In-Stock

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$0.103

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1,373

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Vyrian

USA . 2,154 parts In-Stock

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$0.108

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2,154

$0.108

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Distributors (Availability)

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Corphita

USA . 123 parts In-Stock

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$0.097

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123

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Vigor

Singapore . 395 parts In-Stock

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$0.100

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395

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Corohmni

South Africa . 242 parts In-Stock

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$0.108

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242

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Kulean Microsystems

USA . 4,124 parts In-Stock

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SupplyDigital Components

Austria . 3,739 parts In-Stock

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Problanco Electronics

Mexico . 321 parts In-Stock

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321

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Microchip USA

USA . 181 parts In-Stock

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TANS Electronics

Latvia . 154 parts In-Stock

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154

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UHIMA Technologies

Türkiye . 14 parts In-Stock

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Overview

Enhance your electronic projects with the NLV14066BCP by Onsemi, a top-quality multiplexer and switch that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this versatile component features 4 functions and separate outputs, making it ideal for a wide range of applications. With a durable plastic/epoxy package body and MILITARY-grade temperature grade, this product ensures long-lasting durability in any environment. Upgrade your designs today with the NLV14066BCP and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external factors, making this product suitable for various environments.

No. of Functions: 4

Having 4 functions in one multiplexer/switch offers versatility and efficiency in managing multiple inputs/outputs.

Power Supplies (V): 5/15

Being compatible with power supplies of 5V and 15V makes this product versatile and adaptable to different power systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand heat and operate efficiently in various industrial settings.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it reliable for sensitive applications.

Technical Specifications

Multiplexers & Switches NLV14066BCP attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e0

Normal Position (V):

NO

No. of Functions:

4

No. of Terminals:

14

Maximum On-state Resistance (Ron):

1200 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

NLV14066BCP Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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