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NLV14053BDTR2G

Onsemi

NLV14053BDTR2G by Onsemi

NLV14053BDTR2G by Onsemi is a CMOS SPDT multiplexer with 3 functions, 2 channels, and on-state resistance of 1200 ohm. Operating b/w -55 to 125 °C, it has a peak reflow temp of 260C and supports power supplies of 5/15V. Ideal for military-grade applications requiring high signal current switching in compact designs.

Median Price

$0.430

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,440 parts In-Stock

1+ parts

$0.245

100+ parts

-

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1,440

$0.245

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Rochester

USA . 88,892 parts In-Stock

1+ parts

$0.430

100+ parts

$0.420

1k+ parts

$0.410

10k+ parts

-

88,892

$0.430

$0.420

$0.410

-

DigiKey

USA . 2,500 parts In-Stock

1+ parts

$0.580

100+ parts

$0.320

1k+ parts

$0.277

10k+ parts

$0.251

2,500

$0.580

$0.320

$0.277

$0.251

Mouser Electronics

USA . 2,084 parts In-Stock

1+ parts

$0.580

100+ parts

$0.320

1k+ parts

$0.277

10k+ parts

$0.254

2,084

$0.580

$0.320

$0.277

$0.254

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

1+ parts

-

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5,000

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Chip1Stop

Japan . 1,860 parts In-Stock

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1,860

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Verical

USA . 1,440 parts In-Stock

1+ parts

-

100+ parts

$0.245

1k+ parts

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1,440

-

$0.245

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 343 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

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343

$0.158

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-

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Vyrian

USA . 95 parts In-Stock

1+ parts

$0.166

100+ parts

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95

$0.166

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Flip Electronics

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Distributors (Availability)

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Corphita

USA . 497 parts In-Stock

1+ parts

$0.149

100+ parts

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497

$0.149

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Corohmni

South Africa . 343 parts In-Stock

1+ parts

$0.240

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343

$0.240

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Vigor

Singapore . 140 parts In-Stock

1+ parts

$0.290

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140

$0.290

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Kepictronics

USA . 90,992 parts In-Stock

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90,992

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Problanco Electronics

Mexico . 7,634 parts In-Stock

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7,634

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TANS Electronics

Latvia . 6,305 parts In-Stock

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6,305

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SupplyDigital Components

Austria . 6,244 parts In-Stock

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6,244

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Kulean Microsystems

USA . 1,899 parts In-Stock

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1,899

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Microchip USA

USA . 1,770 parts In-Stock

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1,770

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UHIMA Technologies

Türkiye . 552 parts In-Stock

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552

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Overview

Experience the superior quality and reliability of Onsemi with the NLV14053BDTR2G multiplexer. This versatile component offers 3 functions in a compact, durable package, making it ideal for a wide range of applications. Whether you're looking to streamline your design process or enhance the performance of your system, this product delivers exceptional value and efficiency. Trust Onsemi to provide cutting-edge technology and innovative solutions for all your switching needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and can withstand various environmental conditions, making this product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during production.

No. of Functions: 3

Having multiple functions in one device increases versatility and functionality, making this multiplexer/switch a cost-effective solution for various applications.

Power Supplies (V): 5/15

Support for multiple power supply voltages allows for compatibility with different systems, providing flexibility in usage.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even in demanding conditions, enhancing the product's reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this multiplexer/switch energy-efficient and reliable in signal processing.

Technical Specifications

Multiplexers & Switches NLV14053BDTR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Maximum On-state Resistance (Ron):

1200 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NLV14053BDTR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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