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TS5A3159DCKRG4

Texas Instruments

TS5A3159DCKRG4 by Texas Instruments

TS5A3159DCKRG4 by Texas Instruments is a SPDT switch with 6 terminals, operating at 1.8/5V. It offers low on-state resistance of 3.2 ohm and high off-state isolation of 63 dB. Ideal for industrial applications requiring fast switching times and compact design in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 94,960 parts In-Stock

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Vyrian

USA . 4,821 parts In-Stock

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Bristol Electronics

USA . 1,861 parts In-Stock

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Digiode

USA . 158 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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One Stop Electronics

USA . 429 parts In-Stock

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$2.500

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429

$2.500

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Ampacity Inc.

Singapore . 689 parts In-Stock

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$3.500

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689

$3.500

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Semicontronic

India . 1,100 parts In-Stock

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$6.500

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$6.338

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$6.305

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$6.500

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$10.206

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$9.696

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$9.696

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40

$10.206

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$9.696

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Parana Technologies

USA . 1,313 parts In-Stock

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$14.987

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$15.413

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DigiPath Technology Company

USA . 1,507 parts In-Stock

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$16.502

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$15.182

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$16.502

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ChromeModa Solutions

Germany . 1,540 parts In-Stock

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$16.839

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$13.808

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$16.839

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IDEA Electronic Components Group

UK . 1,379 parts In-Stock

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$15.997

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$15.155

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AZTECH Wire

Italy . 578 parts In-Stock

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Corohmni

South Africa . 286 parts In-Stock

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Metaverse IC Inc.

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Kepictronics

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Argo Parts USA

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A-Z Elektronik GmbH

Germany . 1,902 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Upgrade your electronic devices with the TS5A3159DCKRG4 from Texas Instruments, a leading manufacturer known for superior quality and reliability. This multiplexer/switch offers seamless integration into a variety of applications, providing customers with enhanced performance and flexibility. With a compact design and efficient power management, this product ensures optimal functionality while maintaining high standards of durability and precision. Trust Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects today with the TS5A3159DCKRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable yet lightweight, perfect for portable or compact electronics.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and space.

Nominal Supply Voltage (Vsup): 1.8 V

Efficiently operates at a low supply voltage of 1.8V, making it suitable for energy-efficient applications.

Power Supplies (V): 1.8/5

Compatible with power supplies of 1.8V and 5V, offering flexibility in various circuit designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C ensures reliability even in demanding environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the longevity of the product.

Maximum On-state Resistance (Ron): 3.2 ohm

Low maximum on-state resistance ensures minimal power loss and efficient signal transmission.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle a maximum supply voltage of 5.5V, making it suitable for a wide range of applications.

Technical Specifications

Multiplexers & Switches TS5A3159DCKRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Additional Features:

2-CHANNEL MUX/DEMUX

Other IC type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

63 dB

Nominal On-state Resistance Match:

.7 ohm

Maximum On-state Resistance (Ron):

3.2 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Maximum Switch-off Time:

70 ns

Maximum Switch-on Time:

95 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

TS5A3159DCKRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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