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TS5A23157DGSR

Texas Instruments

TS5A23157DGSR by Texas Instruments

TS5A23157DGSR by Texas Instruments is a 2-channel SPDT switch with 140 ohm Ron, 220 kHz bandwidth, and 60 dB isolation. Ideal for industrial applications requiring separate outputs and dual terminals in a compact thin profile package. Operating from -40 to 85°C with low supply current of 0.01 mA.

Median Price

$0.228

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 364,463 parts In-Stock

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Mouser Electronics

USA . 6,714 parts In-Stock

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Arrow

USA . 5,000 parts In-Stock

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Verical

USA . 1,838 parts In-Stock

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Chip1Stop

Japan . 396 parts In-Stock

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Rochester

USA . 168 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 448 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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Forefront Electronics and Design

USA . 3 parts In-Stock

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Vyrian

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Bristol Electronics

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Atlantic Semiconductor

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Cyclops Electronics Ltd

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Lantek

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Infinite Electronics LLP

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SPM Sales

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Prism Electronics

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Netsource Technology, Inc.

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Semi Source

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Electronics Depot

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Semicontronic

India . 53,588 parts In-Stock

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$0.150

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$0.146

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Ampacity Inc.

Singapore . 53,514 parts In-Stock

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Corphita

USA . 4,609 parts In-Stock

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Component Stockers USA

USA . 30,891 parts In-Stock

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Continental Prestige Electronics

USA . 6,396 parts In-Stock

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Argo Parts USA

USA . 1,602 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Corohmni

South Africa . 282 parts In-Stock

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Parana Technologies

USA . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 2,254 parts In-Stock

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$23.817

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$22.626

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$21.435

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ChromeModa Solutions

Germany . 1,167 parts In-Stock

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$23.817

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$19.530

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GreenTree Electronics

Israel . 120,000 parts In-Stock

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Perfect Parts

USA . 86,737 parts In-Stock

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Singapore . 40,000 parts In-Stock

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USA . 38,259 parts In-Stock

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Epart123

USA . 20,000 parts In-Stock

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Lixinc

USA . 10,971 parts In-Stock

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A-Z Elektronik GmbH

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Technoshack Inc. (Excess)

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S.R.D Solutions

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DigiPath Technology Company

USA . 1,635 parts In-Stock

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XScomponents

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Computer Components Inc. - USA

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iodParts Technologies Inc.

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Authorized Procurement Solutions

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Netroflash

USA . 500 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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$0.501

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Lucentia Tech

USA . 200 parts In-Stock

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Overview

Experience seamless and efficient switching with the TS5A23157DGSR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers quality products like this SPDT switch to meet your multiplexing needs with precision and reliability. Ideal for applications requiring high-performance and low power consumption, this switch offers exceptional value by providing separate outputs, minimal on-state resistance, and superior off-state isolation. Upgrade your systems today with the TS5A23157DGSR and enjoy the benefits of enhanced performance and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components, ensuring durability and reliability.

Surface Mount: YES

Surface mount design allows for easier and more efficient installation on circuit boards, saving space and optimizing the layout.

No. of Functions: 2

Having two functions adds versatility and flexibility to the product, allowing for multiple operations or configurations.

Nominal Supply Voltage (Vsup): 1.8 V

Low nominal supply voltage helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows the product to function in both extreme cold and hot environments.

Nominal Bandwidth: 220 kHz

High nominal bandwidth ensures fast and efficient data transmission, making it suitable for high-speed applications.

Maximum On-state Resistance (Ron): 140 ohm

Low on-state resistance minimizes signal loss and distortion, contributing to overall signal integrity.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching prevents short circuits and ensures smooth transitions between different input/output channels.

Technical Specifications

Multiplexers & Switches TS5A23157DGSR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Additional Features:

VIDEO APPLICATION

Other IC type:

Nominal Bandwidth:

220 kHz

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO/NC

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

10

Nominal Off-state Isolation:

60 dB

Nominal On-state Resistance Match:

1 ohm

Maximum On-state Resistance (Ron):

140 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.01 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Maximum Switch-off Time:

13 ns

Maximum Switch-on Time:

24 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TS5A23157DGSR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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