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NLV14052BDR2G

Onsemi

NLV14052BDR2G by Onsemi

NLV14052BDR2G by Onsemi is a CMOS differential multiplexer with 4 channels. It operates at temperatures from -55 to 125 °C and has a max on-state resistance of 1200 ohm. Suitable for military applications, it features a small outline package style and matte tin terminal finish.

Median Price

$0.401

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,490 parts In-Stock

1+ parts

$0.710

100+ parts

$0.397

1k+ parts

$0.348

10k+ parts

$0.313

2,490

$0.710

$0.397

$0.348

$0.313

Rochester

USA . 208,898 parts In-Stock

1+ parts

-

100+ parts

$0.387

1k+ parts

$0.321

10k+ parts

$0.286

208,898

-

$0.387

$0.321

$0.286

Verical

USA . 177,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.401

10k+ parts

$0.357

177,500

-

-

$0.401

$0.357

Distributors (In-Stock)

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Digiode

USA . 1,879 parts In-Stock

1+ parts

$0.300

100+ parts

-

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-

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1,879

$0.300

-

-

-

Vyrian

USA . 1,079 parts In-Stock

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$0.316

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1,079

$0.316

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Flip Electronics

USA . 10,000 parts In-Stock

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10,000

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Distributors (Availability)

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Corphita

USA . 1,653 parts In-Stock

1+ parts

$0.284

100+ parts

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1,653

$0.284

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Corohmni

South Africa . 232 parts In-Stock

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$0.316

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232

$0.316

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Vigor

Singapore . 365 parts In-Stock

1+ parts

$0.330

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365

$0.330

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Continental Prestige Electronics

USA . 213,316 parts In-Stock

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$0.330

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213,316

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-

$0.330

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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RC Electronics

USA . 21,600 parts In-Stock

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21,600

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Problanco Electronics

Mexico . 8,185 parts In-Stock

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8,185

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Kepictronics

USA . 7,609 parts In-Stock

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7,609

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SupplyDigital Components

Austria . 7,599 parts In-Stock

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7,599

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Kulean Microsystems

USA . 5,954 parts In-Stock

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5,954

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TANS Electronics

Latvia . 3,344 parts In-Stock

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3,344

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UHIMA Technologies

Türkiye . 480 parts In-Stock

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480

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Overview

Experience the superior quality and reliability of Onsemi's NLV14052BDR2G, a cutting-edge multiplexer designed for a wide range of applications. With a military-grade temperature rating, this differential multiplexer offers unparalleled performance in harsh environments. Its small outline package and dual terminal position make it easy to integrate into any project, while its low on-state resistance ensures efficient operation. Trust Onsemi for advanced technology and innovative solutions that deliver value and peace of mind to customers looking for top-notch performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and resistant to external elements, ensuring the reliability and longevity of the product.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Power Supplies (V): 5/15

Support for multiple power supply voltages (5V and 15V) offers flexibility in different application scenarios.

No. of Terminals: 16

Having a higher number of terminals allows for more connections and customization options in the circuit design.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance in demanding environmental conditions.

Temperature Grade: MILITARY

Military-grade temperature tolerance indicates ruggedness and reliability, suitable for harsh environments and critical applications.

No. of Channels: 4

With 4 channels, this multiplexer offers versatility in data routing and selection, making it suitable for various signal processing tasks.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and compatibility with a wide range of digital devices.

Technical Specifications

Multiplexers & Switches NLV14052BDR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

16

Maximum On-state Resistance (Ron):

1200 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NLV14052BDR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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