Loading...

NLV14053BCPG

Onsemi

NLV14053BCPG by Onsemi

NLV14053BCPG by Onsemi is a CMOS SPDT multiplexer with 3 functions, operating at temperatures from -55 to 125 °C. It has 16 terminals in an in-line package style and can handle signal currents up to 0.025A. Ideal for military-grade applications requiring high on-state resistance of 1200 ohms and break-before-make switching at power supplies of 5/15V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,333

-

-

-

-

Vyrian

USA . 936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

936

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 5,183 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,183

-

-

-

-

Problanco Electronics

Mexico . 3,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,960

-

-

-

-

SupplyDigital Components

Austria . 2,388 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,388

-

-

-

-

Corphita

USA . 1,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,738

-

-

-

-

TANS Electronics

Latvia . 620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

620

-

-

-

-

Corohmni

South Africa . 237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

237

-

-

-

-

UHIMA Technologies

Türkiye . 92 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

92

-

-

-

-

Overview

Enhance your electronic design projects with the NLV14053BCPG multiplexer and switch by Onsemi. With a reputation for high-quality products, Onsemi delivers reliable performance and durability in every component they manufacture. Ideal for a variety of applications, this versatile device offers customers the flexibility and efficiency they need to optimize their systems. Trust Onsemi to provide innovative solutions that meet your needs and exceed your expectations. Experience the difference with the NLV14053BCPG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Functions: 3

With three functions available, this multiplexer/switch offers versatility and flexibility in operation.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic setups and circuits.

Power Supplies (V): 5/15

With multiple power supply options, this product can be easily adapted to different voltage requirements.

No. of Terminals: 16

Having 16 terminals enables connections to multiple devices or components, expanding the utility of the product.

Package Style (Meter): IN-LINE

The in-line package style facilitates neat and organized installation within a circuit or system.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the product can function effectively in a wide range of environments.

Terminal Finish: Tin (Sn)

The tin terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

The dual terminal position allows for easy connectivity and flexibility in wiring configurations.

Other IC type: SPDT

The SPDT (Single Pole Double Throw) configuration offers versatility in switching between two different signal paths.

Maximum On-state Resistance (Ron): 1200 ohm

The low on-state resistance minimizes signal loss and ensures efficient signal transmission.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliability and durability in harsh operating conditions.

No. of Channels: 2

With two channels, this product can handle multiple signal inputs or outputs simultaneously.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and stable connections on a circuit board.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch provides compatibility with standard PCB layouts and components.

Maximum Signal Current: 0.025 A

The maximum signal current rating ensures compatibility with a wide range of electronic devices and applications.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature ensures seamless transitions between signal paths, preventing signal interference or distortion.

Technical Specifications

Multiplexers & Switches NLV14053BCPG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Maximum On-state Resistance (Ron):

1200 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Surface Mount:

NO

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

NLV14053BCPG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19