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HEF4051BT

NXP Semiconductors

HEF4051BT by NXP Semiconductors

HEF4051BT by NXP Semiconductors is a single-ended multiplexer with 8 channels. It operates at a nominal voltage of 5V and has a max on-state resistance of 2500 ohm. This CMOS technology-based device is commonly used in automotive applications due to its small outline package and wide temperature range (-40°C to 125°C).

Median Price

$0.217

Lifecycle Status

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USA . 150 parts In-Stock

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Poland . 1 parts In-Stock

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Bristol Electronics

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AZTECH Wire

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Overview

Discover the HEF4051BT by NXP Semiconductors, a high-quality multiplexer and switch that offers unparalleled performance and reliability. Manufactured by industry leader NXP Semiconductors, this product is designed with cutting-edge technology to meet the demands of various applications. With its small outline package and wide temperature range, it is suitable for automotive use as well. The HEF4051BT provides customers with incredible value, delivering seamless switching capabilities and precise control. Experience the benefits of its low power consumption, fast response time, and excellent isolation. Unlock new possibilities with the HEF4051BT and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and longevity of the product, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation, saving time and effort during the assembly process.

No. of Functions: 1

With a single function, this multiplexer/switch simplifies circuitry and reduces complexity, making it an ideal choice for compact designs.

Package Shape: RECTANGULAR

The rectangular shape of the package offers compatibility with standard layouts and facilitates easy integration into existing systems.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage ensures compatibility with common power sources, enabling seamless integration into various electronic setups.

Power Supplies (V): 5/15

This multiplexer/switch can operate with both 5V and 15V power supplies, providing flexibility for different system requirements.

No. of Terminals: 16

With 16 terminals, this product offers ample connectivity options, allowing for versatile connections and enhanced functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates space-saving and compact designs, making it suitable for applications with limited space availability.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding environments, enhancing the product's overall durability.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this multiplexer/switch can function reliably in extreme cold conditions, expanding its usability in various applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold in the terminal finish enhances conductivity and resistance to corrosion, ensuring reliable connections and prolonged product lifespan.

Terminal Position: DUAL

The dual terminal position allows for versatile PCB placement options, providing flexibility during the assembly process.

Maximum Seated Height: 1.75 mm

The compact maximum seated height makes this product suitable for applications with limited vertical space, allowing for efficient and space-saving designs.

Width (mm): 3.9 mm

With a narrow width of 3.9mm, this multiplexer/switch can be integrated into compact circuits and tight spaces, maximizing design possibilities.

Other IC type: SINGLE-ENDED MULTIPLEXER

The use of single-ended multiplexer IC type enables simplified circuitry and efficient signal routing, making it an excellent choice for various electronic applications.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage requirement of 3V allows for compatibility with lower power sources, offering flexibility in system design and power utilization.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product ensures proper soldering during assembly, resulting in reliable and secure connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and improved durability, enhancing the overall performance and lifespan of the product.

Maximum On-state Resistance (Ron): 2500 ohm

The maximum on-state resistance of 2500 ohm ensures minimal signal loss and high-quality signal transmission, making it an ideal choice for applications requiring precise data integrity.

Maximum Switch-on Time: 280 ns

With a fast maximum switch-on time of 280 nanoseconds, this multiplexer/switch ensures quick and efficient signal routing, optimizing system response and performance.

Length: 9.9 mm

The compact length of 9.9mm allows for space-efficient designs and easy integration into various electronic systems with size limitations.

Maximum Switch-off Time: 240 ns

The fast maximum switch-off time of 240 nanoseconds ensures efficient signal routing and minimizes signal interference, enabling precise and accurate data transmission.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in automotive environments, making this multiplexer/switch suitable for automotive applications requiring robust performance.

Maximum Supply Current (Isup): 0.6 mA

With a low maximum supply current of 0.6 mA, this product offers energy-efficient operation, minimizing power consumption and enhancing overall system efficiency.

No. of Channels: 8

With 8 channels, this multiplexer/switch provides ample signal routing options, making it suitable for applications requiring multiple inputs/outputs and signal management.

Technology: CMOS

The use of complementary metal-oxide-semiconductor (CMOS) technology ensures low power consumption, high noise immunity, and compatibility with a wide range of electronic systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy and secure soldering onto PCBs, ensuring reliable connections and simplifying the assembly process.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for efficient and accurate placement of this multiplexer/switch on PCBs, enabling smooth integration into various electronic designs.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level of 1 indicates that this product has a low sensitivity to moisture, increasing its reliability and usability in different environments.

Maximum Supply Voltage (Vsup): 15 V

The maximum supply voltage of 15V provides compatibility with higher voltage systems, offering versatility and flexibility for a wide range of applications.

Maximum Signal Current: 0.01 A

With a maximum signal current of 0.01A, this multiplexer/switch can reliably handle moderate to low-current signals, making it suitable for numerous electronic applications.

Nominal Off-state Isolation: 50 dB

The nominal off-state isolation of 50 decibels ensures minimal cross-talk and interference between channels, maintaining signal integrity and accurate data transmission.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching enables smooth and reliable signal routing, preventing signal glitches and disturbances during switching operations.

Nominal On-state Resistance Match: 25 ohm

The nominal on-state resistance match of 25 ohms ensures uniform signal routing and balanced load distribution, optimizing signal quality and overall system performance.

Technical Specifications

Multiplexers & Switches HEF4051BT attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

25 ohm

Maximum On-state Resistance (Ron):

2500 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.01 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.6 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

240 ns

Maximum Switch-on Time:

280 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

HEF4051BT Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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