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NGTG15N120FL2WG

Onsemi

NGTG15N120FL2WG by Onsemi

NGTG15N120FL2WG by Onsemi is an N-CHANNEL IGBT with 294W power dissipation, 175 °C max temp, and 1200V collector-emitter voltage. Ideal for high-power applications like motor drives, inverters, and industrial equipment due to its 20A collector current capacity and 6.5V gate-emitter threshold voltage.

Median Price

$1.890

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,790 parts In-Stock

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-

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$1.890

1k+ parts

$1.690

10k+ parts

$1.590

1,790

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$1.890

$1.690

$1.590

DigiKey

USA . 1,350 parts In-Stock

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$1.750

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1,350

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$1.750

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Flip Electronics (Authorized)

USA . 1,350 parts In-Stock

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1,350

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Verical

USA . 1,200 parts In-Stock

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$2.112

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$1.988

1,200

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$2.112

$1.988

Distributors (In-Stock)

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Vyrian

USA . 1,912 parts In-Stock

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$1.750

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1,912

$1.750

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Digiode

USA . 1,245 parts In-Stock

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$1.995

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$1.995

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Flip Electronics

USA . 1,350 parts In-Stock

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1,350

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Distributors (Availability)

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Corohmni

South Africa . 263 parts In-Stock

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$1.750

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263

$1.750

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Corphita

USA . 1,124 parts In-Stock

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$1.890

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$1.890

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Component Stockers USA

USA . 2,064 parts In-Stock

1+ parts

$2.170

100+ parts

$2.030

1k+ parts

$1.840

10k+ parts

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2,064

$2.170

$2.030

$1.840

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Microchip USA

USA . 498 parts In-Stock

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$13.130

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Problanco Electronics

Mexico . 7,829 parts In-Stock

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Kulean Microsystems

USA . 5,428 parts In-Stock

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SupplyDigital Components

Austria . 4,812 parts In-Stock

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TANS Electronics

Latvia . 2,158 parts In-Stock

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Continental Prestige Electronics

USA . 1,790 parts In-Stock

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$2.290

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1,790

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$2.290

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Perfect Parts

USA . 1,008 parts In-Stock

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UHIMA Technologies

Türkiye . 522 parts In-Stock

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522

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Experience the unbeatable quality and reliability of the NGTG15N120FL2WG by Onsemi, a leading manufacturer in the industry. This N-CHANNEL Insulated Gate Bipolar Transistor (IGBT) offers exceptional performance and efficiency, making it perfect for a wide range of applications. From power supplies to motor drives, this product provides the value and benefits that customers are looking for. Trust in Onsemi's expertise and choose the NGTG15N120FL2WG for all your electronic needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high-speed switching capabilities and are commonly used in high-power applications, making this product suitable for applications requiring efficient power management.

Maximum Power Dissipation (Abs): 294 W

With a high maximum power dissipation, this IGBT can handle heavy loads and operate at high power levels without the risk of overheating, ensuring reliability in demanding applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows this IGBT to withstand elevated temperatures, making it suitable for industrial and automotive applications where heat dissipation is critical.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating provides a wide voltage range for operation, making this IGBT suitable for high voltage applications such as power supplies and inverters.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage rating ensures reliable and safe operation of the IGBT by preventing overvoltage conditions that may damage the device, making it ideal for precision control applications.

Maximum Collector Current (IC): 20 A

With a high maximum collector current rating, this IGBT can handle large current loads, making it suitable for high-power switching applications where high current levels are required.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage determines the turn-on voltage of the IGBT, and with a low threshold voltage, this IGBT can switch on and off quickly, making it ideal for high-frequency applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides good solderability and ensures a reliable electrical connection, while the annealing process enhances the durability of the terminals, making this IGBT suitable for rugged environments.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTG15N120FL2WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Trade Compliance

NGTG15N120FL2WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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