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NGTG35N65FL2WG

Onsemi

NGTG35N65FL2WG by Onsemi

The Onsemi NGTG35N65FL2WG is an N-CHANNEL IGBT with 650V VCE, 70A IC, and 231ns toff. Ideal for POWER CONTROL applications, it features a PLASTIC/EPOXY package, SINGLE configuration, and RECTANGULAR shape for FLANGE MOUNT installation.

Median Price

$1.830

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10 parts In-Stock

1+ parts

$0.590

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10

$0.590

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Chip1Stop

Japan . 30 parts In-Stock

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$1.260

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$1.150

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$1.260

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DigiKey

USA . 30 parts In-Stock

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$4.690

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$2.616

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30

$4.690

$2.616

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Rochester

USA . 19,945 parts In-Stock

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$1.830

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$1.640

10k+ parts

$1.540

19,945

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$1.830

$1.640

$1.540

Verical

USA . 13,560 parts In-Stock

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$2.050

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$1.925

13,560

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$1.925

Flip Electronics (Authorized)

USA . 200 parts In-Stock

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Digiode

USA . 822 parts In-Stock

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$0.560

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Vyrian

USA . 5,366 parts In-Stock

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Corphita

USA . 2,028 parts In-Stock

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$0.531

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$0.531

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Component Stockers USA

USA . 23,850 parts In-Stock

1+ parts

$0.570

100+ parts

$1.960

1k+ parts

$1.770

10k+ parts

$1.770

23,850

$0.570

$1.960

$1.770

$1.770

Corohmni

South Africa . 438 parts In-Stock

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$0.590

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438

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.249

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$2.047

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$1.844

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$2.249

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Microchip USA

USA . 280 parts In-Stock

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$24.115

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Continental Prestige Electronics

USA . 19,950 parts In-Stock

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$1.920

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Kulean Microsystems

USA . 8,380 parts In-Stock

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TANS Electronics

Latvia . 5,629 parts In-Stock

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SupplyDigital Components

Austria . 2,382 parts In-Stock

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UHIMA Technologies

Türkiye . 726 parts In-Stock

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Kepictronics

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Perfect Parts

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Problanco Electronics

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Authorized Procurement Solutions

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Overview

Unlock the power of precise and efficient power control with the NGTG35N65FL2WG Insulated Gate Bipolar Transistor by Onsemi. Crafted from high-quality materials and designed for single-channel applications, this transistor offers a maximum collector-emitter voltage of 650V and a collector current of 70A. Ideal for a wide range of power control applications, this product ensures optimal performance and reliability. Experience superior quality and seamless functionality with the NGTG35N65FL2WG - your key to unlocking unparalleled efficiency and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good insulation and protection for the internal components of the IGBT, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally offer better conductivity and lower on-state resistance compared to P-channel IGBTs, making them suitable for high power control applications.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage allows this IGBT to handle high voltage power control applications effectively.

Maximum Collector Current (IC): 70 A

With a high maximum collector current rating, this IGBT can handle high current power control applications with ease.

Nominal Turn Off Time (toff): 231 ns

The fast turn-off time of 231 ns ensures efficient power control and minimizes switching losses in the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTG35N65FL2WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

231 ns

Nominal Turn On Time (ton):

108 ns

Trade Compliance

NGTG35N65FL2WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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