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NGTG25N120FL2WG

Onsemi

NGTG25N120FL2WG by Onsemi

NGTG25N120FL2WG by Onsemi is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 50A max collector current, and 385W max power dissipation. Ideal for power control applications due to its single configuration and fast turn-off time of 430ns.

Median Price

$2.587

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 48,084 parts In-Stock

1+ parts

-

100+ parts

$2.310

1k+ parts

$2.070

10k+ parts

$1.940

48,084

-

$2.310

$2.070

$1.940

DigiKey

USA . 48,084 parts In-Stock

1+ parts

-

100+ parts

$3.040

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48,084

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$3.040

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Verical

USA . 32,064 parts In-Stock

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$2.587

10k+ parts

$2.425

32,064

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$2.587

$2.425

Distributors (In-Stock)

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Vyrian

USA . 1,198 parts In-Stock

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$2.070

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1,198

$2.070

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Digiode

USA . 2,287 parts In-Stock

1+ parts

$2.442

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2,287

$2.442

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Nova Conductors

Japan . 100 parts In-Stock

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100

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IBS Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 51 parts In-Stock

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$2.070

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51

$2.070

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Corphita

USA . 2,000 parts In-Stock

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$2.313

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2,000

$2.313

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Ampacity Inc.

Singapore . 47,828 parts In-Stock

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$3.830

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47,828

$3.830

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Microchip USA

USA . 382 parts In-Stock

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$15.990

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382

$15.990

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Continental Prestige Electronics

USA . 52,265 parts In-Stock

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$2.070

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Kulean Microsystems

USA . 6,797 parts In-Stock

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SupplyDigital Components

Austria . 6,725 parts In-Stock

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TANS Electronics

Latvia . 2,608 parts In-Stock

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UHIMA Technologies

Türkiye . 811 parts In-Stock

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Infinite Electronics LLP (Excess)

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Problanco Electronics

Mexico . 237 parts In-Stock

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Netroflash

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Overview

Unlock the power of efficient power control with the NGTG25N120FL2WG by Onsemi. Manufactured by a trusted industry leader, this insulated gate bipolar transistor (IGBT) offers high-quality performance in a variety of applications. Whether you're looking to optimize energy consumption or enhance motor drives, this N-channel single configuration transistor provides value, reliability, and versatility. Take your projects to the next level with the NGTG25N120FL2WG and experience the benefits of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-resistance and higher efficiency, making them suitable for power control applications.

Configuration: SINGLE

The single configuration simplifies the design and reduces component count in the circuit, leading to cost-effectiveness.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers efficient and reliable performance in managing high levels of power.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide easy and secure mounting on a circuit board, ensuring proper connectivity and stability.

Nominal Turn Off Time (toff): 430 ns

The fast turn off time of 430 ns allows for quick switching operations, reducing power losses and improving efficiency.

Maximum Power Dissipation (Abs): 385 W

With a high maximum power dissipation of 385 W, this IGBT can handle high power levels without overheating, ensuring reliable operation.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures stable performance even in demanding environments with elevated temperatures.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage of 1200 V allows for operation in high voltage applications, making it versatile and suitable for various scenarios.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20 V provides reliable gate control and protection against voltage spikes, ensuring safe and efficient operation.

Maximum Collector Current (IC): 50 A

With a maximum collector current of 50 A, this IGBT can handle high current loads, making it suitable for power control applications requiring high current handling capacity.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a reliable and low-resistance connection, ensuring stable performance and enhanced conductivity.

Nominal Turn On Time (ton): 178 ns

The fast turn on time of 178 ns enables quick switching operations, improving overall efficiency and reducing power losses.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTG25N120FL2WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

430 ns

Nominal Turn On Time (ton):

178 ns

Trade Compliance

NGTG25N120FL2WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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