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NGD8205NT4G

Onsemi

NGD8205NT4G by Onsemi

NGD8205NT4G by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 390V and a max gate-emitter voltage of 15V. It is designed for automotive ignition applications, featuring a built-in diode and resistor in a small outline package style. With a max power dissipation of 125W, it operates at temperatures up to 175 °C, making it suitable for high-performance automotive systems.

Median Price

$1.190

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 87,296 parts In-Stock

1+ parts

-

100+ parts

$1.190

1k+ parts

$0.988

10k+ parts

$0.881

87,296

-

$1.190

$0.988

$0.881

DigiKey

USA . 87,296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.010

10k+ parts

$1.010

87,296

-

-

$1.010

$1.010

Verical

USA . 87,296 parts In-Stock

1+ parts

-

100+ parts

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$1.235

10k+ parts

$1.101

87,296

-

-

$1.235

$1.101

Distributors (In-Stock)

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Digiode

USA . 1,089 parts In-Stock

1+ parts

$0.926

100+ parts

-

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-

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1,089

$0.926

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-

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Vyrian

USA . 1,051 parts In-Stock

1+ parts

$0.975

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-

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1,051

$0.975

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ComSIT Distribution GmbH

Germany . 250 parts In-Stock

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250

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Distributors (Availability)

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Corphita

USA . 1,867 parts In-Stock

1+ parts

$0.878

100+ parts

-

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1,867

$0.878

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Corohmni

South Africa . 129 parts In-Stock

1+ parts

$0.975

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129

$0.975

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Microchip USA

USA . 6,869 parts In-Stock

1+ parts

$6.110

100+ parts

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6,869

$6.110

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Continental Prestige Electronics

USA . 87,296 parts In-Stock

1+ parts

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100+ parts

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$0.933

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87,296

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-

$0.933

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Kepictronics

USA . 27,860 parts In-Stock

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27,860

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Problanco Electronics

Mexico . 7,540 parts In-Stock

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7,540

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A-Z Elektronik GmbH

Germany . 7,218 parts In-Stock

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7,218

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TANS Electronics

Latvia . 3,590 parts In-Stock

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3,590

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Kulean Microsystems

USA . 3,264 parts In-Stock

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3,264

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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SupplyDigital Components

Austria . 2,024 parts In-Stock

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2,024

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UHIMA Technologies

Türkiye . 913 parts In-Stock

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913

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Overview

Unleash the power of automotive ignition with the NGD8205NT4G by Onsemi. This insulated gate bipolar transistor (IGBT) boasts top-notch quality and reliability from a trusted manufacturer. With a single configuration featuring a built-in diode and resistor, this surface-mount transistor offers unmatched performance in automotive applications. Experience seamless operation and optimal power dissipation, thanks to its advanced design. Elevate your projects with the NGD8205NT4G and enjoy the benefits of high efficiency, durability, and precision. Choose excellence, choose Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the IGBT lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower ON-state voltage drop and higher efficiency compared to P-channel IGBTs, making them suitable for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Having a built-in diode and resistor simplifies the circuit design and can improve system reliability.

Transistor Application: AUTOMOTIVE IGNITION

Specifically designed for automotive ignition applications, ensuring reliable performance in high-voltage environments.

Surface Mount: YES

Surface mount technology allows for easy integration onto printed circuit boards, saving space and simplifying assembly.

Maximum Rise Time (tr): 8000 ns

The relatively fast rise time enables quick switching, reducing switching losses and improving efficiency.

Maximum Power Dissipation (Abs): 125 W

With a high power dissipation capability, this IGBT can handle high power levels without overheating.

Maximum Operating Temperature: 175 °C

The high operating temperature range ensures reliability in automotive applications where temperature fluctuations can occur.

Maximum Collector-Emitter Voltage: 390 V

The high maximum voltage rating allows for use in applications where high voltages are present.

Maximum Collector Current (IC): 20 A

With a high collector current rating, this IGBT can handle high currents without overheating.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGD8205NT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Fall Time (tf):

14000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

15 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

8000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

18500 ns

Nominal Turn On Time (ton):

6500 ns

Trade Compliance

NGD8205NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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