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NGD8201ANT4G

Onsemi

NGD8201ANT4G by Onsemi

NGD8201ANT4G by Onsemi is an N-CHANNEL IGBT with 400V max collector-emitter voltage, 20A max collector current, and 125W max power dissipation. Ideal for power control applications, it features a built-in diode and resistor in a small outline package suitable for surface mount assembly.

Median Price

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Lifecycle Status

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9

In-Stock Inventory

1k+

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Chip Stock

USA . 11,500 parts In-Stock

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Q Components

USA . 8,800 parts In-Stock

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Vyrian

USA . 2,109 parts In-Stock

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Digiode

USA . 1,777 parts In-Stock

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J2 Sourcing AB

Sweden . 1,731 parts In-Stock

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Connector Distribution Corp

USA . 1,000 parts In-Stock

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Right Parts Inc.

USA . 1,000 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 697 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 619 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 4,398 parts In-Stock

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$0.980

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$0.930

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$0.900

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$1.947

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$1.772

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$1.597

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550

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Kepictronics

USA . 56,000 parts In-Stock

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Perfect Parts

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TANS Electronics

Latvia . 7,958 parts In-Stock

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Kulean Microsystems

USA . 7,384 parts In-Stock

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Problanco Electronics

Mexico . 5,939 parts In-Stock

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Infinite Electronics LLP (Excess)

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SupplyDigital Components

Austria . 2,681 parts In-Stock

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S.R.D Solutions

India . 2,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,740 parts In-Stock

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Assy Fe

Spain . 1,300 parts In-Stock

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UHIMA Technologies

Türkiye . 862 parts In-Stock

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Corphita

USA . 529 parts In-Stock

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Corohmni

South Africa . 67 parts In-Stock

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Overview

Unlock the power of efficient and reliable power control with the NGD8201ANT4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for a wide range of applications. With a single configuration, built-in diode and resistor, this product offers unparalleled value and benefits to customers looking for high-performance solutions. Say goodbye to inefficiency and hello to optimized power control with the NGD8201ANT4G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify the circuit design and save space, making it convenient for integration into different systems.

Maximum Power Dissipation (Abs): 125 W

With a high maximum power dissipation, this IGBT can handle substantial power loads, providing reliable performance in power control applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the IGBT to operate in harsh environments without overheating, improving its overall reliability.

Maximum Collector-Emitter Voltage: 400 V

The high collector-emitter voltage rating ensures that the IGBT can withstand high voltage levels, making it suitable for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGD8201ANT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

400 V

Maximum Fall Time (tf):

14000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

15 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

8000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

18500 ns

Nominal Turn On Time (ton):

6500 ns

Trade Compliance

NGD8201ANT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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