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NGD8201NT4G

Onsemi

NGD8201NT4G by Onsemi

NGD8201NT4G by Onsemi is an N-CHANNEL IGBT with 20A IC, 400V VCE, and 125W power dissipation. Ideal for power control applications, it features a built-in diode and resistor in a small outline package suitable for surface mount technology.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,887 parts In-Stock

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Chip Stock

USA . 2,740 parts In-Stock

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Digiode

USA . 1,671 parts In-Stock

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AZTECH Wire

Italy . 726 parts In-Stock

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$17.860

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726

$17.860

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Ampacity Inc.

Singapore . 489 parts In-Stock

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$29.050

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489

$29.050

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Kepictronics

USA . 27,860 parts In-Stock

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SupplyDigital Components

Austria . 5,643 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 4,557 parts In-Stock

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TANS Electronics

Latvia . 3,085 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kulean Microsystems

USA . 2,566 parts In-Stock

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Problanco Electronics

Mexico . 2,366 parts In-Stock

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Corphita

USA . 2,070 parts In-Stock

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Corohmni

South Africa . 416 parts In-Stock

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UHIMA Technologies

Türkiye . 372 parts In-Stock

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Overview

Enhance your power control applications with the NGD8201NT4G by Onsemi. As a leading manufacturer of Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers exceptional quality and reliability. This N-channel transistor boasts a single configuration with a built-in diode and resistor, offering maximum efficiency and performance. With a maximum collector current of 20A and a rise time of 8000ns, this IGBT is ideal for a wide range of power control applications. Trust Onsemi to provide you with cutting-edge technology that delivers value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower on-state resistance and higher switching speeds compared to P-CHANNEL types, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor help to protect the transistor and simplify circuit design, making it more convenient for users.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, providing reliability and efficiency in controlling high power loads.

Maximum Power Dissipation (Abs): 125 W

With a high maximum power dissipation value, this IGBT can handle high power loads without risking damage due to overheating.

Maximum Collector-Emitter Voltage: 400 V

The high maximum collector-emitter voltage allows this IGBT to be used in high voltage applications with ease.

Maximum Gate-Emitter Voltage: 15 V

The maximum gate-emitter voltage ensures safe and reliable operation of the transistor within specified limits.

Maximum Collector Current (IC): 20 A

Capable of handling high collector currents, making it suitable for applications requiring high power output.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGD8201NT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

400 V

Maximum Fall Time (tf):

14000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

15 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

8000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

18500 ns

Nominal Turn On Time (ton):

6500 ns

Trade Compliance

NGD8201NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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