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NGD8205ANT4G

Onsemi

NGD8205ANT4G by Onsemi

N-CHANNEL; Surface Mount: YES; Maximum Power Dissipation (Abs): 125 W; Maximum Collector Current (IC): 20 A; Maximum Operating Temperature: 175 Cel; Peak Reflow Temperature (C): 260;

Median Price

$0.973

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,295 parts In-Stock

1+ parts

$4.500

100+ parts

$1.780

1k+ parts

$1.320

10k+ parts

-

2,295

$4.500

$1.780

$1.320

-

Rochester

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

$0.938

1k+ parts

$0.778

10k+ parts

$0.694

7,500

-

$0.938

$0.778

$0.694

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.973

10k+ parts

$0.868

5,000

-

-

$0.973

$0.868

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 375 parts In-Stock

1+ parts

$0.620

100+ parts

-

1k+ parts

-

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375

$0.620

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Digiode

USA . 1,481 parts In-Stock

1+ parts

$0.731

100+ parts

-

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1,481

$0.731

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DigiKey Marketplace

USA . 8,022 parts In-Stock

1+ parts

-

100+ parts

$0.800

1k+ parts

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8,022

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$0.800

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ComSIT Distribution GmbH

Germany . 351 parts In-Stock

1+ parts

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351

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 444 parts In-Stock

1+ parts

$0.620

100+ parts

-

1k+ parts

-

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444

$0.620

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Corphita

USA . 426 parts In-Stock

1+ parts

$0.692

100+ parts

-

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426

$0.692

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Component Stockers USA

USA . 21,810 parts In-Stock

1+ parts

$0.790

100+ parts

$0.740

1k+ parts

$0.670

10k+ parts

-

21,810

$0.790

$0.740

$0.670

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Microchip USA

USA . 265 parts In-Stock

1+ parts

$4.810

100+ parts

-

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265

$4.810

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Kepictronics

USA . 104,129 parts In-Stock

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104,129

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Perfect Parts

USA . 63,946 parts In-Stock

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63,946

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Continental Prestige Electronics

USA . 8,022 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.620

10k+ parts

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8,022

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-

$0.620

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SupplyDigital Components

Austria . 6,565 parts In-Stock

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6,565

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A-Z Elektronik GmbH

Germany . 6,293 parts In-Stock

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6,293

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TANS Electronics

Latvia . 5,503 parts In-Stock

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5,503

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Problanco Electronics

Mexico . 2,485 parts In-Stock

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2,485

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GreenTree Electronics

Israel . 2,295 parts In-Stock

1+ parts

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2,295

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UHIMA Technologies

Türkiye . 692 parts In-Stock

1+ parts

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692

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Kulean Microsystems

USA . 580 parts In-Stock

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580

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Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGD8205ANT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Fall Time (tf):

14000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

15 V

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

8000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NGD8205ANT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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