Loading...

NGD8201BNT4G

Onsemi

NGD8201BNT4G by Onsemi

NGD8201BNT4G by Onsemi is an N-CHANNEL IGBT with max power dissipation of 115W, operating temp of 175 °C, and collector-emitter voltage of 430V. Ideal for applications requiring high power handling such as motor drives and inverters due to its fast rise/fall times (tr: 7000ns, tf: 15000ns).

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,176

-

-

-

-

Vyrian

USA . 1,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,797

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,201 parts In-Stock

1+ parts

$34.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,201

$34.050

-

-

-

SupplyDigital Components

Austria . 7,922 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,922

-

-

-

-

Kulean Microsystems

USA . 7,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,220

-

-

-

-

TANS Electronics

Latvia . 6,859 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,859

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Corphita

USA . 2,032 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,032

-

-

-

-

UHIMA Technologies

Türkiye . 708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

708

-

-

-

-

Corohmni

South Africa . 393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

393

-

-

-

-

Problanco Electronics

Mexico . 266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

266

-

-

-

-

Overview

Unleash the power of innovation with the NGD8201BNT4G by Onsemi. As a trusted leader in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. This N-CHANNEL device boasts exceptional performance and reliability, making it ideal for a wide range of applications. From industrial machinery to renewable energy systems, this IGBT offers unmatched value, efficiency, and durability. Elevate your projects to new heights with the NGD8201BNT4G and experience the difference that Onsemi brings to the table.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically offer lower on-state voltage drop and higher current handling capability compared to P-Channel IGBTs, making them a good choice for high power applications.

Surface Mount: YES

Surface mount IGBTs are easy to install and take up less space on a PCB, making them ideal for applications where space is a constraint.

Maximum Rise Time (tr): 7000 ns

The low rise time ensures fast switching speeds, making this IGBT suitable for applications requiring quick response times.

Maximum Fall Time (tf): 15000 ns

The high fall time ensures minimal switching losses, improving efficiency in high-frequency applications.

Maximum Power Dissipation (Abs): 115 W

With a high power dissipation rating, this IGBT can handle high power levels without overheating, ensuring reliable performance.

Maximum Operating Temperature: 175 °C

The high operating temperature capability allows this IGBT to be used in harsh environments without degradation in performance.

Maximum Collector-Emitter Voltage: 430 V

The high breakdown voltage ensures reliable operation in high voltage applications, making this IGBT a versatile choice.

Maximum Gate-Emitter Voltage: 18 V

The high gate-emitter voltage rating allows for safe operation and precise control of the IGBT, enhancing overall circuit reliability.

Maximum Collector Current (IC): 15 A

The high collector current rating allows for handling of high current loads, making this IGBT suitable for power electronics applications.

Maximum Gate-Emitter Threshold Voltage: 1.8 V

The low gate-emitter threshold voltage ensures low power consumption and efficient operation of the IGBT.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and thermal conductivity, ensuring reliable connections in the assembly process.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes thermal stress on the device during assembly, increasing overall reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for reliable solder joints in the assembly process, ensuring long-term stability.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGD8201BNT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

430 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

1.8 V

Maximum Gate-Emitter Voltage:

18 V

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

7000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NGD8201BNT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 12