Loading...

NDD60N550U1-1G

Onsemi

NDD60N550U1-1G by Onsemi

NDD60N550U1-1G by Onsemi is a N-CHANNEL FET with 8.5A ID and 96W power dissipation. Ideal for high-power applications, it operates up to 150 °C with TIN finish, MSL level 3, and peak reflow temp of 260°C in METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,475 parts In-Stock

1+ parts

-

100+ parts

$1.000

1k+ parts

$0.830

10k+ parts

$0.740

20,475

-

$1.000

$0.830

$0.740

Farnell

UK . 20,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.951

10k+ parts

-

20,475

-

-

$0.951

-

Verical

USA . 17,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.038

10k+ parts

$0.925

17,400

-

-

$1.038

$0.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 806 parts In-Stock

1+ parts

$0.782

100+ parts

-

1k+ parts

-

10k+ parts

-

806

$0.782

-

-

-

Vyrian

USA . 6,388 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,388

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,100 parts In-Stock

1+ parts

$0.741

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

$0.741

-

-

-

Corohmni

South Africa . 52 parts In-Stock

1+ parts

$0.823

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$0.823

-

-

-

Microchip USA

USA . 9,261 parts In-Stock

1+ parts

$5.135

100+ parts

-

1k+ parts

-

10k+ parts

-

9,261

$5.135

-

-

-

AZTECH Wire

Italy . 952 parts In-Stock

1+ parts

$12.350

100+ parts

-

1k+ parts

-

10k+ parts

-

952

$12.350

-

-

-

Continental Prestige Electronics

USA . 20,475 parts In-Stock

1+ parts

-

100+ parts

$0.755

1k+ parts

-

10k+ parts

-

20,475

-

$0.755

-

-

TANS Electronics

Latvia . 3,183 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,183

-

-

-

-

Kulean Microsystems

USA . 2,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,023

-

-

-

-

Problanco Electronics

Mexico . 1,547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,547

-

-

-

-

UHIMA Technologies

Türkiye . 613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

613

-

-

-

-

SupplyDigital Components

Austria . 486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

486

-

-

-

-

Perfect Parts

USA . 353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

353

-

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Enhance your power management systems with the NDD60N550U1-1G by Onsemi. Designed with precision and quality in mind, this N-CHANNEL Power FET offers a reliable solution for a variety of applications. With a maximum drain current of 8.5 A and a power dissipation of 96 W, this transistor ensures optimal performance even under demanding conditions. Trust Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations. Upgrade your power systems today and experience the efficiency and reliability that the NDD60N550U1-1G brings to the table.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high conductivity and efficiency, making them ideal for high-power applications.

Maximum Drain Current (ID): 8.5 A

With a high maximum drain current, this FET can handle heavy loads without overheating, ensuring reliable performance.

Maximum Power Dissipation: 96 W

The high power dissipation capability of this FET allows it to operate at high power levels without the risk of damage, making it suitable for demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs are known for their low leakage current and high switching speeds, making them efficient and reliable for a wide range of applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand high temperatures without compromising performance, making it suitable for harsh environmental conditions.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, ensuring easy and reliable connection in various applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates that this FET can withstand exposure to moderate levels of moisture during handling and assembly, making it easier to work with in manufacturing processes.

Peak Reflow Temperature: 260 C

The high peak reflow temperature allows for reliable solder joints during the assembly process, ensuring long-term performance of the FET in various applications.

Technical Specifications

Power Field Effect Transistors (FET) NDD60N550U1-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

8.5 A

Maximum Drain Current (ID):

8.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NDD60N550U1-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11