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NDD60N900U1-1G

Onsemi

NDD60N900U1-1G by Onsemi

NDD60N900U1-1G by Onsemi is a N-channel FET with 5.9A max drain current and 74W power dissipation. Ideal for power applications, it operates up to 150°C, making it suitable for high-temperature environments requiring efficient power management.

Median Price

$0.713

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 29,016 parts In-Stock

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$0.713

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29,016

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$0.713

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Nova Conductors

Japan . 15 parts In-Stock

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$0.595

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Vyrian

USA . 6,148 parts In-Stock

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Digiode

USA . 2,459 parts In-Stock

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Corohmni

South Africa . 330 parts In-Stock

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$0.584

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330

$0.584

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Argo Parts USA

USA . 3,494 parts In-Stock

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$0.595

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$0.578

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Netroflash

USA . 500 parts In-Stock

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$0.595

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$0.566

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$0.554

500

$0.595

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$0.566

$0.554

Ampacity Inc.

Singapore . 28,609 parts In-Stock

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$0.610

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Microchip USA

USA . 7,272 parts In-Stock

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$3.835

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AZTECH Wire

Italy . 239 parts In-Stock

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$14.270

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Continental Prestige Electronics

USA . 29,016 parts In-Stock

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Problanco Electronics

Mexico . 7,350 parts In-Stock

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Kulean Microsystems

USA . 1,283 parts In-Stock

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TANS Electronics

Latvia . 880 parts In-Stock

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SupplyDigital Components

Austria . 524 parts In-Stock

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UHIMA Technologies

Türkiye . 519 parts In-Stock

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Corphita

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Perfect Parts

USA . 84 parts In-Stock

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Overview

Power up your projects with the NDD60N900U1-1G by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are reliable and efficient. Ideal for applications requiring N-channel configuration, this FET offers a maximum drain current of 5.9A and a maximum power dissipation of 74W. With its advanced metal-oxide semiconductor technology and high operating temperature of 150°C, this transistor ensures optimal performance and longevity. Trust Onsemi to provide you with superior products that bring value and benefits to your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are suitable for applications requiring high current capabilities and low on-resistance, making this product a good choice for power applications.

Maximum Drain Current (Abs) (ID): 5.9 A

With a maximum drain current of 5.9 A, this FET can handle high current loads efficiently, making it suitable for power applications.

Maximum Power Dissipation (Abs): 74 W

The high maximum power dissipation of 74 W ensures that the FET can handle power efficiently without overheating, making it reliable for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology provides good performance and reliability, making this FET a good choice for demanding applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can operate reliably in high-temperature environments, making it suitable for industrial applications.

Terminal Finish: TIN

The TIN terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection in various environmental conditions.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this FET has a moderate sensitivity to moisture, making it suitable for standard assembly processes and environments.

Maximum Time At Peak Reflow Temperature (s): 30

The FET can withstand up to 30 seconds at peak reflow temperatures, making it suitable for reflow soldering processes in manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FET can be reliably soldered using standard reflow techniques, ensuring a strong and durable electrical connection.

Technical Specifications

Power Field Effect Transistors (FET) NDD60N900U1-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

5.9 A

Maximum Drain Current (ID):

5.9 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NDD60N900U1-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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