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NDD60N745U1T4G

Onsemi

NDD60N745U1T4G by Onsemi

NDD60N745U1T4G by Onsemi is a N-CHANNEL FET with 6.8A max drain current and 83W max power dissipation. Ideal for power applications, it operates at up to 150 °C and features surface mount configuration for efficient PCB assembly.

Median Price

$0.885

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,565 parts In-Stock

1+ parts

-

100+ parts

$0.885

1k+ parts

$0.735

10k+ parts

$0.655

10,565

-

$0.885

$0.735

$0.655

DigiKey

USA . 10,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.750

10k+ parts

$0.750

10,565

-

-

$0.750

$0.750

Verical

USA . 10,497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.918

10k+ parts

$0.819

10,497

-

-

$0.918

$0.819

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,260 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

-

10k+ parts

-

2,260

$0.690

-

-

-

Vyrian

USA . 1,590 parts In-Stock

1+ parts

$0.726

100+ parts

-

1k+ parts

-

10k+ parts

-

1,590

$0.726

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,436 parts In-Stock

1+ parts

$0.653

100+ parts

-

1k+ parts

-

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-

1,436

$0.653

-

-

-

Corohmni

South Africa . 195 parts In-Stock

1+ parts

$0.726

100+ parts

-

1k+ parts

-

10k+ parts

-

195

$0.726

-

-

-

Modulus Dynamics

Lithuania . 5 parts In-Stock

1+ parts

$2.122

100+ parts

$2.122

1k+ parts

$2.122

10k+ parts

-

5

$2.122

$2.122

$2.122

-

Microchip USA

USA . 4,576 parts In-Stock

1+ parts

$4.550

100+ parts

-

1k+ parts

-

10k+ parts

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4,576

$4.550

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Perfect Parts

USA . 13,272 parts In-Stock

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13,272

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Continental Prestige Electronics

USA . 12,065 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.666

10k+ parts

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12,065

-

-

$0.666

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Problanco Electronics

Mexico . 7,427 parts In-Stock

1+ parts

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7,427

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SupplyDigital Components

Austria . 2,693 parts In-Stock

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2,693

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TANS Electronics

Latvia . 1,665 parts In-Stock

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1,665

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Kepictronics

USA . 1,005 parts In-Stock

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1,005

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Kulean Microsystems

USA . 484 parts In-Stock

1+ parts

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484

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UHIMA Technologies

Türkiye . 153 parts In-Stock

1+ parts

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153

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Overview

Experience the power of innovation with the NDD60N745U1T4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are ideal for a wide range of applications. From enhancing efficiency in electronic devices to improving overall performance, this N-CHANNEL FET offers unmatched reliability and durability. Say goodbye to power limitations and hello to limitless possibilities with the NDD60N745U1T4G. Elevate your projects to new heights with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher mobility, leading to better performance compared to P-channel FETs.

Configuration: SINGLE

Single configuration FETs are simpler to work with and offer easier circuit design compared to dual or quad configurations.

Surface Mount: YES

Surface mount FETs are compact, lightweight, and suitable for high-density circuit designs, making them ideal for modern electronic devices.

Maximum Drain Current (Abs) (ID): 6.8 A

With a high maximum drain current, this FET can handle high power applications and deliver reliable performance.

Maximum Power Dissipation (Abs): 83 W

The high power dissipation capability of this FET ensures efficient energy handling and prevents overheating during operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high input impedance and low output impedance, making them suitable for a wide range of applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures and operate reliably in various environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability and ensures secure connections for reliable performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a short maximum time at peak reflow temperature, this FET is easy to solder and minimizes the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of this FET ensures robust soldering and reliable connections even in demanding manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) NDD60N745U1T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

6.8 A

Maximum Drain Current (ID):

6.8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NDD60N745U1T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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