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NDD60N360U1-1G

Onsemi

NDD60N360U1-1G by Onsemi

NDD60N360U1-1G by Onsemi is a Power FET with 600V DS Breakdown Voltage, 44A IDM, and 64mJ EAS. Ideal for applications requiring high power dissipation in single-channel configurations with built-in diode, such as industrial motor drives or power supplies.

Median Price

$1.398

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 37,650 parts In-Stock

1+ parts

-

100+ parts

$1.370

1k+ parts

$1.140

10k+ parts

$1.010

37,650

-

$1.370

$1.140

$1.010

Verical

USA . 34,500 parts In-Stock

1+ parts

-

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-

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$1.425

10k+ parts

$1.262

34,500

-

-

$1.425

$1.262

Distributors (In-Stock)

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Digiode

USA . 997 parts In-Stock

1+ parts

$1.074

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997

$1.074

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Vyrian

USA . 4,349 parts In-Stock

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4,349

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Distributors (Availability)

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Corphita

USA . 1,473 parts In-Stock

1+ parts

$1.017

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-

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1,473

$1.017

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Corohmni

South Africa . 265 parts In-Stock

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$1.130

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265

$1.130

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AZTECH Wire

Italy . 906 parts In-Stock

1+ parts

$8.090

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906

$8.090

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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Continental Prestige Electronics

USA . 37,650 parts In-Stock

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$1.030

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37,650

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$1.030

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QUARKTWIN TECHNOLOGY LTD

USA . 13,068 parts In-Stock

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13,068

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Kulean Microsystems

USA . 5,686 parts In-Stock

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5,686

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SupplyDigital Components

Austria . 5,405 parts In-Stock

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Microchip USA

USA . 5,182 parts In-Stock

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5,182

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Problanco Electronics

Mexico . 2,806 parts In-Stock

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2,806

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UHIMA Technologies

Türkiye . 354 parts In-Stock

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354

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TANS Electronics

Latvia . 39 parts In-Stock

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39

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Overview

Experience unparalleled power and efficiency with the NDD60N360U1-1G by Onsemi. Crafted with precision and innovation, this Power Field Effect Transistor is a game-changer in the industry. From enhancing motor control systems to optimizing power supplies, this product offers unrivaled performance and reliability. Trust Onsemi's expertise and elevate your projects to new heights with the NDD60N360U1-1G. Unlock the potential of your applications and see the difference that quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, making it reliable and durable.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching and control in applications where N-channel FETs are preferred.

Minimum DS Breakdown Voltage: 600 V

Suitable for high voltage applications, ensuring the transistor can handle significant power levels.

Maximum Power Dissipation (Abs): 114 W

Capable of dissipating high power levels, making it suitable for demanding applications.

Maximum Drain-Source On Resistance: 0.36 ohm

Low on-resistance allows for efficient conduction and minimal power loss in the transistor.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, suitable for industrial or high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) NDD60N360U1-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

64 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.36 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

44 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NDD60N360U1-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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