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NDD60N360U1T4G

Onsemi

NDD60N360U1T4G by Onsemi

NDD60N360U1T4G by Onsemi is a N-CHANNEL FET with 600V DS Breakdown Voltage, 44A IDM, and 0.36 ohm RDS. Ideal for power applications, it operates in Enhancement Mode with 114W Power Dissipation and 150 °C Max Temp.

Median Price

$1.370

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 106 parts In-Stock

1+ parts

$0.625

100+ parts

$0.492

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106

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$0.492

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Rochester

USA . 37,626 parts In-Stock

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$1.370

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$1.140

10k+ parts

$1.010

37,626

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$1.370

$1.140

$1.010

DigiKey

USA . 37,626 parts In-Stock

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$1.710

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37,626

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$1.710

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Verical

USA . 35,000 parts In-Stock

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$1.425

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$1.262

35,000

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$1.425

$1.262

Chip1Stop

Japan . 107 parts In-Stock

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$0.486

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107

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$0.486

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Digiode

USA . 1,120 parts In-Stock

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$0.583

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Chip Stock

USA . 25,000 parts In-Stock

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Vyrian

USA . 5,851 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 241 parts In-Stock

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$0.388

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$0.388

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Corphita

USA . 351 parts In-Stock

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$0.553

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351

$0.553

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Microchip USA

USA . 393 parts In-Stock

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$7.020

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$7.020

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AZTECH Wire

Italy . 767 parts In-Stock

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$11.000

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$11.000

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Continental Prestige Electronics

USA . 37,626 parts In-Stock

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$1.030

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37,626

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Perfect Parts

USA . 25,945 parts In-Stock

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Kulean Microsystems

USA . 4,481 parts In-Stock

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Kepictronics

USA . 3,647 parts In-Stock

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RC Electronics

USA . 2,880 parts In-Stock

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SupplyDigital Components

Austria . 2,228 parts In-Stock

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TANS Electronics

Latvia . 971 parts In-Stock

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Problanco Electronics

Mexico . 743 parts In-Stock

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UHIMA Technologies

Türkiye . 261 parts In-Stock

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Overview

Enhance your power management solutions with the NDD60N360U1T4G by Onsemi. As a leading manufacturer in the industry, Onsemi has crafted this N-CHANNEL Power Field Effect Transistor with a built-in diode, ensuring high performance and reliability. Ideal for a variety of applications, this transistor offers customers exceptional value with its 600V minimum DS breakdown voltage, 44A maximum pulsed drain current, and 114W maximum power dissipation. Trust Onsemi to deliver quality products that meet your needs efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, resulting in easier handling and improved overall product longevity.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL configuration allows for efficient power management in electronic circuits, making it a versatile option for various applications.

Minimum DS Breakdown Voltage: 600 V

With a high minimum breakdown voltage of 600V, this FET can handle high-power applications with ease, ensuring reliable performance even in demanding conditions.

Maximum Pulsed Drain Current (IDM): 44 A

The high maximum pulsed drain current of 44A allows the FET to handle sudden bursts of power effectively, making it suitable for applications requiring high current capabilities.

Maximum Power Dissipation (Abs): 114 W

The high maximum power dissipation of 114W indicates the FET's ability to efficiently dissipate heat generated during operation, ensuring reliable performance over extended periods.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can function effectively in high-temperature environments, making it suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NDD60N360U1T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

64 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.36 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

44 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NDD60N360U1T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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