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NDD60N745U1-1G

Onsemi

NDD60N745U1-1G by Onsemi

NDD60N745U1-1G by Onsemi is a N-channel Power FET with 6.8A max drain current and 83W max power dissipation. Ideal for high-power applications, it operates at up to 150 °C and features metal-oxide semiconductor technology. Suitable for various industrial and automotive uses due to its robust design and high performance capabilities.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 6,802 parts In-Stock

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Digiode

USA . 2,124 parts In-Stock

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Flip Electronics

USA . 1,725 parts In-Stock

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AZTECH Wire

Italy . 361 parts In-Stock

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$16.650

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Kulean Microsystems

USA . 5,250 parts In-Stock

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SupplyDigital Components

Austria . 3,720 parts In-Stock

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TANS Electronics

Latvia . 2,333 parts In-Stock

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Problanco Electronics

Mexico . 1,670 parts In-Stock

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UHIMA Technologies

Türkiye . 648 parts In-Stock

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Perfect Parts

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Corphita

USA . 380 parts In-Stock

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Corohmni

South Africa . 374 parts In-Stock

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Microchip USA

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Overview

Unlock the power of innovation with the NDD60N745U1-1G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-quality products that deliver exceptional performance. This Power FET is perfect for a wide range of applications, offering reliable and efficient operation. Experience the value and benefits of this product, from its high power dissipation to its N-channel configuration. Trust Onsemi to provide cutting-edge technology that meets your needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and reliability, making them a popular choice in power electronics applications.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and makes the FET easier to integrate into various electronic systems.

Maximum Drain Current (Abs) (ID): 6.8 A

6.8 A high drain current capability allows for effective handling of heavy loads, making this FET suitable for high-power applications.

Maximum Power Dissipation (Abs): 83 W

83 W maximum power dissipation ensures efficient heat dissipation and enhances the overall reliability of the FET in demanding operating conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

METAL-OXIDE SEMICONDUCTOR technology offers high speed switching performance and low power consumption, making the FET ideal for high-frequency applications.

Maximum Operating Temperature: 150 °C

150 °C maximum operating temperature allows the FET to withstand high temperature environments, ensuring stable performance in challenging conditions.

Terminal Finish: TIN

TIN terminal finish provides excellent solderability and corrosion resistance, contributing to the long-term durability of the FET in various environmental conditions.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the FET has a moderate sensitivity to moisture, allowing for safe storage and handling during assembly processes.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures proper soldering of the FET during assembly, preventing any damage to the device.

Peak Reflow Temperature °C: 260

260 °C peak reflow temperature promotes reliable solder joints and prevents overheating of the FET, ensuring long-term performance and stability.

Technical Specifications

Power Field Effect Transistors (FET) NDD60N745U1-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

6.8 A

Maximum Drain Current (ID):

6.8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NDD60N745U1-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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