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NDD60N360U1-35G

Onsemi

NDD60N360U1-35G by Onsemi

NDD60N360U1-35G by Onsemi is a Power FET with 600V DS Breakdown Voltage, 44A IDM, and 64mJ EAS. Ideal for power applications requiring high drain current handling capabilities in enhancement mode operation.

Median Price

$1.370

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 32,775 parts In-Stock

1+ parts

-

100+ parts

$1.370

1k+ parts

$1.140

10k+ parts

$1.010

32,775

-

$1.370

$1.140

$1.010

DigiKey

USA . 32,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.180

10k+ parts

$1.180

32,775

-

-

$1.180

$1.180

Verical

USA . 31,125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.425

10k+ parts

$1.262

31,125

-

-

$1.425

$1.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 246 parts In-Stock

1+ parts

$1.074

100+ parts

-

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-

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246

$1.074

-

-

-

Vyrian

USA . 2,161 parts In-Stock

1+ parts

$1.130

100+ parts

-

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2,161

$1.130

-

-

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Flip Electronics

USA . 450 parts In-Stock

1+ parts

-

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450

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 835 parts In-Stock

1+ parts

$1.017

100+ parts

-

1k+ parts

-

10k+ parts

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835

$1.017

-

-

-

Corohmni

South Africa . 55 parts In-Stock

1+ parts

$1.130

100+ parts

-

1k+ parts

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10k+ parts

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55

$1.130

-

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Component Stockers USA

USA . 21,948 parts In-Stock

1+ parts

$1.150

100+ parts

$1.080

1k+ parts

$0.980

10k+ parts

$0.980

21,948

$1.150

$1.080

$0.980

$0.980

Microchip USA

USA . 190 parts In-Stock

1+ parts

$7.020

100+ parts

-

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10k+ parts

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190

$7.020

-

-

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Continental Prestige Electronics

USA . 32,775 parts In-Stock

1+ parts

-

100+ parts

$0.926

1k+ parts

-

10k+ parts

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32,775

-

$0.926

-

-

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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15,000

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SupplyDigital Components

Austria . 5,277 parts In-Stock

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5,277

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Kulean Microsystems

USA . 3,999 parts In-Stock

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3,999

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TANS Electronics

Latvia . 2,996 parts In-Stock

1+ parts

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2,996

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UHIMA Technologies

Türkiye . 920 parts In-Stock

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920

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Problanco Electronics

Mexico . 578 parts In-Stock

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578

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Perfect Parts

USA . 84 parts In-Stock

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84

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Overview

Power up your applications with the NDD60N360U1-35G from Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality Power FETs that provide reliable performance and durability. Whether you're looking to enhance the efficiency of your power supply or improve motor control systems, this N-Channel FET with a built-in diode is the perfect solution. With a high breakdown voltage of 600V and a maximum drain current of 11A, you can trust this transistor to handle your power needs with ease. Say goodbye to overheating and inefficiency - choose Onsemi for power you can rely on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher current carrying capabilities compared to P-channel FETs, making them suitable for high power applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications with ease, providing safety and reliability in operation.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this FET allows for reverse current protection and efficient switching, making it suitable for applications where protection against voltage spikes is important.

Maximum Pulsed Drain Current (IDM): 44 A

The high pulsed drain current rating allows for handling peak current demands without issues, making this FET suitable for high-power applications with intermittent high current requirements.

Maximum Power Dissipation (Abs): 114 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, ensuring reliable operation in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer good performance characteristics such as low ON-resistance and high switching speeds, making them ideal for power management applications.

Maximum Operating Temperature: 150 °C

The high operating temperature rating allows this FET to operate in a wide range of temperature environments, ensuring stability and reliability in varying conditions.

Technical Specifications

Power Field Effect Transistors (FET) NDD60N360U1-35G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

64 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.36 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

44 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NDD60N360U1-35G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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