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NCV7512FTG

Onsemi

NCV7512FTG by Onsemi

NCV7512FTG by Onsemi is a peripheral driver with 32 terminals and built-in transient protection. It operates b/w -40 to 125 °C, with supply voltage ranging from 3V to 5.5V. Ideal for automotive applications, it features a turn-on/off time of 1us and sink output current flow direction.

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Lifecycle Status

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1k+

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Digiode

USA . 2,324 parts In-Stock

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USA . 642 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$8.845

100+ parts

$8.049

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$7.253

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100

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$7.253

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QUARKTWIN TECHNOLOGY LTD

USA . 10,934 parts In-Stock

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Microchip USA

USA . 4,739 parts In-Stock

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TANS Electronics

Latvia . 4,616 parts In-Stock

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SupplyDigital Components

Austria . 2,805 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 737 parts In-Stock

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UHIMA Technologies

Türkiye . 721 parts In-Stock

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Vigor

Singapore . 389 parts In-Stock

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Corohmni

South Africa . 234 parts In-Stock

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Problanco Electronics

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Overview

Enhance the performance of your automotive applications with the NCV7512FTG peripheral driver by Onsemi. Designed with built-in transient protections and AEC-Q100 screening, this high-quality product ensures reliable operation in harsh environments. With a wide supply voltage range and quick turn-on/off times, this buffer-based driver offers unmatched versatility and efficiency. Trust Onsemi's expertise and elevate your designs with the NCV7512FTG for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability of the product, making it suitable for various environmental conditions.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this peripheral driver can handle a wide range of input voltages, providing flexibility in different applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 screening level ensures the product meets automotive industry standards for quality and reliability.

Built-in Protections: TRANSIENT

The built-in transient protections enhance the robustness of the peripheral driver, safeguarding it against voltage spikes and fluctuations.

Maximum Supply Voltage-1: 5.5 V

The higher maximum supply voltage of 5.5V allows for compatibility with a wider range of power sources, increasing the versatility of the product.

Power Supplies (V): 5

The 5V power supply capability of this peripheral driver ensures stable and reliable operation in various electronic systems.

No. of Terminals: 32

With 32 terminals, this peripheral driver offers ample connectivity options, allowing for versatile integration with other components.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style enables compact and space-saving design, ideal for applications where size constraints are a concern.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40 °C ensures the peripheral driver can function reliably in harsh environments or extreme weather conditions.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this peripheral driver can withstand high temperatures, making it suitable for industrial and automotive applications.

Terminal Finish: TIN

The Tin terminal finish provides good conductivity and corrosion resistance, ensuring stable electrical connections for enhanced performance.

Terminal Position: QUAD

The Quad terminal position facilitates easy and secure connections, simplifying the installation and maintenance of the peripheral driver.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures proper soldering and reliability during the assembly process, making it ideal for mass production.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating indicates that this peripheral driver is designed to meet the stringent requirements of automotive applications, ensuring long-term performance and durability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides stable power input for the peripheral driver, ensuring consistent and efficient operation.

Turn-on Time: 1 us

The quick turn-on time of 1us ensures rapid response and precise control, making this peripheral driver suitable for high-speed applications.

Nominal Supply Voltage-1: 5 V

The nominal supply voltage of 5V offers compatibility with standard power sources, making it easier to integrate this peripheral driver into existing systems.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type provides flexibility in signal processing and control, allowing for customization and compatibility with various communication protocols.

Turn-off Time: 1 us

The fast turn-off time of 1us ensures quick response and precision in switching operations, enhancing the efficiency and performance of the peripheral driver.

Output Current Flow Direction: SINK

The sink output current flow direction allows the peripheral driver to draw current from external devices, enabling efficient control and management of electrical loads.

Technical Specifications

Peripheral Drivers NCV7512FTG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Turn-off Time:

1 us

Turn-on Time:

1 us

Width:

7 mm

Trade Compliance

NCV7512FTG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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