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NCV7601PG

Onsemi

NCV7601PG by Onsemi

NCV7601PG by Onsemi is a 4-function peripheral driver with built-in protections for transient, over current, and thermal issues. Operating at 5V with a max output current of 0.6A, it is ideal for automotive applications due to its AEC-Q100 screening level and AND gate based interface IC type.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,658 parts In-Stock

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5,658

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Digiode

USA . 2,173 parts In-Stock

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2,173

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Nova Conductors

Japan . 50 parts In-Stock

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50

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AZTECH Wire

Italy . 460 parts In-Stock

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$5.329

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460

$5.329

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Ampacity Inc.

Singapore . 1,421 parts In-Stock

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$37.500

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1,421

$37.500

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Problanco Electronics

Mexico . 4,854 parts In-Stock

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TANS Electronics

Latvia . 4,838 parts In-Stock

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Argo Parts USA

USA . 4,582 parts In-Stock

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Continental Prestige Electronics

USA . 2,322 parts In-Stock

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Corphita

USA . 769 parts In-Stock

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769

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Kulean Microsystems

USA . 746 parts In-Stock

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746

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UHIMA Technologies

Türkiye . 654 parts In-Stock

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654

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Microchip USA

USA . 245 parts In-Stock

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Corohmni

South Africa . 221 parts In-Stock

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SupplyDigital Components

Austria . 174 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Enhance your automotive electronic systems with the NCV7601PG by Onsemi, a high-quality peripheral driver that offers built-in protections for transient, over current, and thermal events. Designed with AEC-Q100 screening level, this product ensures reliability and durability in harsh automotive environments. With 4 functions packed into a compact package body material, this device provides superior performance with a nominal output peak current limit of 1.8A. Trust Onsemi's expertise and experience in delivering cutting-edge technology to elevate your applications to the next level. Choose the NCV7601PG for unmatched value, benefits, and advantages in your automotive electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring long-term reliability.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of compatible power sources, making it versatile for different applications.

No. of Functions: 4

Offers multiple functions in a single device, saving space and simplifying circuit design.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, ensuring high performance in demanding environments.

Package Shape: RECTANGULAR

Enables easy integration into existing systems and facilitates compact design.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

Ensures safety and longevity of the device by protecting against common electrical faults.

Power Supplies (V): 5

Operates at a standard voltage level, making it compatible with many power sources.

No. of Terminals: 16

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): IN-LINE

Facilitates easy installation and maintenance in a linear configuration.

Minimum Supply Voltage: 4 V

Allows for operation at lower voltages, conserving energy and reducing heat dissipation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliable performance under harsh conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN

Provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Offers flexibility in installation and enhances connectivity options.

Maximum Seated Height: 4.44 mm

Compact design allows for integration into tight spaces.

Width: 7.62 mm

Space-saving design for efficient use of circuit board real estate.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during assembly processes, ensuring proper soldering.

Length: 19.175 mm

Optimal size for easy integration into existing systems.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for temperature range, ensuring reliable performance in vehicles.

Maximum Output Current: 0.6 A

Sufficient output current for driving peripheral devices.

Technology: BIPOLAR

Utilizes bipolar technology for robust and reliable performance.

Terminal Form: THROUGH-HOLE

Facilitates easy and secure soldering to circuit boards.

Nominal Supply Voltage: 5 V

Standard voltage level for compatibility with various systems.

Turn-on Time: 10 us

Fast turn-on time for quick response to input signals.

Terminal Pitch: 2.54 mm

Standard terminal pitch for compatibility with common connectors.

Driver No. of Bits: 4

4-bit driver for precise control and manipulation of peripheral devices.

Nominal Output Peak Current Limit: 1.8 A

High current limit for driving power-hungry peripheral devices.

Interface IC Type: AND GATE BASED PERIPHERAL DRIVER

Utilizes AND gate logic for efficient control and operation of peripheral devices.

Turn-off Time: 10 us

Fast turn-off time for quick response to changing input signals.

Output Current Flow Direction: SINK

Sink-type output for driving various types of loads effectively.

Technical Specifications

Peripheral Drivers NCV7601PG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.6 A

Nominal Output Peak Current Limit:

1.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

4.44 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

10 us

Width:

7.62 mm

Trade Compliance

NCV7601PG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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