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NCV7710DQR2G

Onsemi

NCV7710DQR2G by Onsemi

HALF BRIDGE BASED PERIPHERAL DRIVER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

$5.130

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,587 parts In-Stock

1+ parts

$2.720

100+ parts

$2.670

1k+ parts

$2.610

10k+ parts

-

1,587

$2.720

$2.670

$2.610

-

DigiKey

USA . 100,309 parts In-Stock

1+ parts

-

100+ parts

$7.540

1k+ parts

$7.540

10k+ parts

$7.540

100,309

-

$7.540

$7.540

$7.540

Distributors (In-Stock)

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Vyrian

USA . 2,406 parts In-Stock

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$7.540

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2,406

$7.540

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Flip Electronics

USA . 600,000 parts In-Stock

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Digiode

USA . 2,062 parts In-Stock

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Nova Conductors

Japan . 52 parts In-Stock

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52

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Distributors (Availability)

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Vigor

Singapore . 466 parts In-Stock

1+ parts

$1.820

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466

$1.820

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Corohmni

South Africa . 242 parts In-Stock

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$7.540

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242

$7.540

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$8.832

100+ parts

$8.037

1k+ parts

$7.242

10k+ parts

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10

$8.832

$8.037

$7.242

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Ampacity Inc.

Singapore . 100,053 parts In-Stock

1+ parts

$13.950

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100,053

$13.950

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Component Stockers USA

USA . 324 parts In-Stock

1+ parts

$99.990

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324

$99.990

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Perfect Parts

USA . 14,650 parts In-Stock

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14,650

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TANS Electronics

Latvia . 6,680 parts In-Stock

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6,680

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A-Z Elektronik GmbH

Germany . 6,396 parts In-Stock

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Kepictronics

USA . 5,585 parts In-Stock

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5,585

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Problanco Electronics

Mexico . 3,797 parts In-Stock

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SupplyDigital Components

Austria . 2,491 parts In-Stock

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2,491

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,510 parts In-Stock

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1,510

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Kulean Microsystems

USA . 729 parts In-Stock

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729

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Microchip USA

USA . 400 parts In-Stock

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400

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UHIMA Technologies

Türkiye . 323 parts In-Stock

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323

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Netroflash

USA . 100 parts In-Stock

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100

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Technical Specifications

Peripheral Drivers NCV7710DQR2G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NCV7710DQR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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