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NCV7120FP0R2G

Onsemi

NCV7120FP0R2G by Onsemi

NCV7120FP0R2G by Onsemi is a peripheral driver with a max supply voltage of 26V and built-in over current protection. It features 64 terminals in a square package shape, suitable for automotive applications due to its AEC-Q100 screening level. With a nominal output peak current limit of 1.65A, it is ideal for buffer or inverter-based interface ICs requiring high reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 6,989 parts In-Stock

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Vyrian

USA . 1,450 parts In-Stock

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Digiode

USA . 57 parts In-Stock

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Ampacity Inc.

Singapore . 274 parts In-Stock

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$38.500

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TANS Electronics

Latvia . 4,648 parts In-Stock

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Problanco Electronics

Mexico . 2,553 parts In-Stock

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Kulean Microsystems

USA . 1,637 parts In-Stock

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Corphita

USA . 1,350 parts In-Stock

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UHIMA Technologies

Türkiye . 615 parts In-Stock

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Corohmni

South Africa . 123 parts In-Stock

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SupplyDigital Components

Austria . 55 parts In-Stock

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Overview

Unleash the power of innovation with the NCV7120FP0R2G by Onsemi, a cutting-edge peripheral driver designed to exceed your expectations. With a focus on quality and reliability, Onsemi is a trusted manufacturer known for delivering exceptional products. The NCV7120FP0R2G offers built-in protections against over current, ensuring the safety of your devices. Ideal for a wide range of applications, this product provides high performance and efficiency, making it a valuable asset for your projects. Experience the advantages of advanced technology with the NCV7120FP0R2G and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and reliability to the peripheral driver, ensuring a long lifespan.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into electronic circuits, making it convenient for users.

Maximum Supply Voltage: 26 V

The high maximum supply voltage of 26V allows for compatibility with a wide range of applications and systems.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the peripheral driver meets automotive industry standards for quality and reliability.

Built-in Protections: OVER CURRENT

The built-in protection against over current helps safeguard connected devices from damage, providing an added layer of safety.

No. of Terminals: 64

The high number of terminals (64) allows for flexibility in connectivity and compatibility with various systems and configurations.

Minimum Supply Voltage: 6 V

The low minimum supply voltage of 6V ensures energy efficiency while still providing reliable performance.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals helps with solderability and conductivity, ensuring a secure connection.

Maximum Output Current: 1.2 A

The maximum output current of 1.2A allows for powering a variety of peripherals and devices, making it versatile for different applications.

Technical Specifications

Peripheral Drivers NCV7120FP0R2G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Output Current:

1.2 A

Nominal Output Peak Current Limit:

1.65 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

NCV7120FP0R2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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