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NCV7601P

Onsemi

NCV7601P by Onsemi

NCV7601P by Onsemi is an AND gate based peripheral driver with 4 functions and built-in protections for transient, over current, and thermal issues. Operating at a voltage range of 4-5.5V, it is ideal for automotive applications with a max output current of 0.6A and turn-on/off time of 10us.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,963 parts In-Stock

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Chip Stock

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Digiode

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$4.067

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$3.701

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$3.335

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500

$4.067

$3.701

$3.335

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AZTECH Wire

Italy . 49 parts In-Stock

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$8.040

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Component Stockers USA

USA . 717 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,909 parts In-Stock

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RC Electronics

USA . 7,516 parts In-Stock

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TANS Electronics

Latvia . 7,170 parts In-Stock

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

Austria . 4,854 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 810 parts In-Stock

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Futuretech Components

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Microchip USA

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Corohmni

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Kepictronics

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Overview

Looking for a reliable peripheral driver that offers top-notch quality and performance? Look no further than the NCV7601P by Onsemi. With built-in protections against transients, over current, and thermal issues, this versatile product provides peace of mind for your applications. Whether you're in the automotive industry or need a trusted solution for your electronic projects, the NCV7601P delivers exceptional value and efficiency. Trust Onsemi, a manufacturer known for their cutting-edge technology and innovation, to provide you with the best in class peripheral drivers. Elevate your projects with the NCV7601P today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures product longevity and ease of handling.

Maximum Supply Voltage: 5.5 V

Wide range of supply voltage allows for compatibility with various systems.

No. of Functions: 4

Multiple functions provide versatility and efficiency in driving peripherals.

Screening Level: AEC-Q100

High screening level ensures reliability and performance in automotive applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and space-saving design.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

Integrated protections ensure safe operation and prevent damage to connected peripherals.

Power Supplies (V): 5

Stable power supply of 5V ensures consistent performance and reliability.

No. of Terminals: 16

Sufficient number of terminals for easy connectivity and flexibility in usage.

Package Style (Meter): IN-LINE

In-line package style allows for easy installation and space-efficient layout.

Minimum Supply Voltage: 4 V

Low minimum supply voltage allows for operation in a variety of power conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in extreme conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in cold environments.

Terminal Finish: TIN LEAD

Tin lead finish provides corrosion resistance and optimal terminal connection.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and easy connectivity.

Maximum Seated Height: 4.44 mm

Low seated height enables compact and space-saving design.

Width: 7.62 mm

Compact width allows for easy integration in tight spaces.

Peak Reflow Temperature °C: 235

High peak reflow temperature allows for reliable soldering during assembly.

Length: 19.175 mm

Optimal length for easy integration and compatibility with standard setups.

Temperature Grade: AUTOMOTIVE

Automotive grade temperature ensures reliable performance in harsh conditions.

Maximum Output Current: 0.6 A

Sufficient output current for driving peripherals with moderate power requirements.

Technology: BIPOLAR

Bipolar technology provides high-speed operation and precise control.

Terminal Form: THROUGH-HOLE

Through-hole terminals allow for secure and reliable connections.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance under varying conditions.

Turn-on Time: 10 us

Fast turn-on time allows for quick response and efficient operation.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy connection and compatibility with existing setups.

Driver No. of Bits: 4

4 bits of driver capability for precise control and versatility in operation.

Nominal Output Peak Current Limit: 1.8 A

High peak output current limit allows for driving peripherals with higher power requirements.

Interface IC Type: AND GATE BASED PERIPHERAL DRIVER

And gate based interface IC type provides logic control for efficient peripheral driving.

Turn-off Time: 10 us

Fast turn-off time ensures quick response and effective control over connected peripherals.

Output Current Flow Direction: SINK

Sink output current flow direction allows for efficient current handling and control in connected peripherals.

Technical Specifications

Peripheral Drivers NCV7601P attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.6 A

Nominal Output Peak Current Limit:

1.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

4.44 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

10 us

Width:

7.62 mm

Trade Compliance

NCV7601P Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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