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NCV7719DQR2G

Onsemi

NCV7719DQR2G by Onsemi

NCV7719DQR2G by Onsemi is a peripheral driver with a max supply voltage of 5.25V and built-in protections for over current, over voltage, thermal, and under voltage. It is an automotive-grade interface IC type that operates at temperatures ranging from -40 to 125 °C. Its compact size (8.64mm length, 3.9mm width) makes it suitable for various applications in the automotive industry.

Median Price

$2.178

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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Bristol Electronics

USA . 99,771 parts In-Stock

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Chip Stock

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Vyrian

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Digiode

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,762 parts In-Stock

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Argo Parts USA

USA . 3,131 parts In-Stock

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Vigor

Singapore . 590 parts In-Stock

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$4.780

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AZTECH Wire

Italy . 587 parts In-Stock

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$18.796

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Ampacity Inc.

Singapore . 569 parts In-Stock

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$49.500

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Infinite Electronics LLP (Excess)

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Lixinc

USA . 12,885 parts In-Stock

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Problanco Electronics

Mexico . 8,206 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,795 parts In-Stock

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SupplyDigital Components

Austria . 3,464 parts In-Stock

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TANS Electronics

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Kulean Microsystems

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Corphita

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Kepictronics

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UHIMA Technologies

Türkiye . 789 parts In-Stock

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Futuretech Components

Singapore . 672 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$2.069

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$2.026

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Microchip USA

USA . 213 parts In-Stock

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Corohmni

South Africa . 156 parts In-Stock

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Overview

Discover the NCV7719DQR2G, a high-quality peripheral driver by Onsemi. With its advanced features and built-in protections against over current, over voltage, thermal, and under voltage, this product offers unparalleled reliability and safety. Designed for automotive applications, this compact and low-profile device is perfect for demanding environments. Experience seamless performance and precise control with the NCV7719DQR2G. Trust Onsemi, a renowned manufacturer known for delivering innovative solutions. Upgrade your systems today and unlock the full potential of your applications with this exceptional peripheral driver.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY: This product's plastic/epoxy package body material ensures a lightweight and durable construction, suitable for various applications.

Surface Mount:

YES: The surface mount capability allows for easy and efficient installation, making this product highly convenient for circuit board assembly.

Maximum Supply Voltage:

5.25 V: With a maximum supply voltage of 5.25 V, this peripheral driver can handle a wide range of voltage inputs, providing flexibility and compatibility.

No. of Functions:

8: The inclusion of 8 functions in this product allows for versatile and multifunctional usage, enhancing its usefulness and value.

Screening Level:

AEC-Q100: Compliant with AEC-Q100 screening level, this peripheral driver meets stringent automotive industry standards, ensuring reliability in automotive applications.

Package Shape:

RECTANGULAR: The rectangular shape of the package offers a compact and space-efficient design, making it easier to fit into electronic systems with limited space.

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE: Boasting built-in protections against over current, over voltage, thermal issues, and under voltage situations, this product guarantees the safety of the connected devices and ensures stable operation.

Maximum Supply Voltage-1:

28 V: The maximum supply voltage-1 capability of 28 V provides compatibility with higher voltage applications, expanding the range of uses for this peripheral driver.

No. of Terminals:

24: Equipped with 24 terminals, this driver offers plenty of connection options, enabling it to drive multiple peripherals simultaneously.

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH: The small outline, heat sink/slug, low profile, and shrink pitch package style enhances thermal management, improves space efficiency, and allows for easy integration into compact systems.

Minimum Supply Voltage-1:

5.5 V: With a minimum supply voltage-1 of 5.5 V, this product can handle lower voltage inputs while maintaining optimal performance, making it suitable for various power supply sources.

Minimum Supply Voltage:

3.15 V: The minimum supply voltage of 3.15 V ensures that this peripheral driver remains operational even with lower power sources, offering flexibility in diverse applications.

Maximum Operating Temperature:

125 °C: Capable of operating at temperatures up to 125°C, this product can withstand high-temperature environments, making it reliable in demanding conditions.

Minimum Operating Temperature:

40 °C: With a minimum operating temperature of -40°C, this peripheral driver can perform flawlessly in extreme cold conditions, expanding its usability in various climates.

Terminal Finish:

NICKEL GOLD PALLADIUM: The terminal finish with nickel, gold, and palladium materials guarantees excellent conductivity, corrosion resistance, and durability, ensuring reliable electrical connections.

Terminal Position:

DUAL: The presence of dual terminal positions provides flexible installation options, accommodating different wiring configurations and making it convenient for various setups.

Maximum Seated Height:

1.7 mm: With a maximum seated height of 1.7 mm, this peripheral driver remains compact and low-profile, enabling it to fit in space-restricted applications without sacrificing functionality.

Width:

3.9 mm: The narrow width of 3.9 mm makes this peripheral driver suitable for compact circuit board designs, saving valuable space in electronic systems.

Maximum Time At Peak Reflow Temperature (s):

30: Able to withstand peak reflow temperatures for up to 30 seconds, this product ensures reliable soldering during the assembly process, minimizing the risk of solder joint failure.

Peak Reflow Temperature °C:

260: The peak reflow temperature of 260°C provides compatibility with standard reflow soldering processes, simplifying manufacturing and assembly procedures.

Length:

8.64 mm: With a length of 8.64 mm, this driver offers a compact form factor, making it suitable for applications with limited space constraints.

Temperature Grade:

AUTOMOTIVE: Meeting automotive-grade temperature standards, this peripheral driver is designed to withstand harsh temperature conditions, making it ideal for automotive applications.

Terminal Form:

GULL WING: The gull-wing terminal form allows for easy visual inspection, facilitates automated handling during assembly, and ensures secure solder joint connections.

Nominal Supply Voltage:

5 V: The nominal supply voltage of 5 V provides a stable power source for this peripheral driver, enabling reliable and consistent operation.

Turn-on Time:

13 us: With a turn-on time of 13 microseconds, this driver exhibits quick response and precise control, enhancing the overall performance and efficiency.

Terminal Pitch:

0.65 mm: The terminal pitch of 0.65 mm allows for close spacing between terminals, enabling high-density circuit board designs and maximizing connectivity options.

Nominal Supply Voltage-1:

13.2 V: The nominal supply voltage-1 capability of 13.2 V provides compatibility with higher voltage applications, expanding the range of uses for this peripheral driver.

Moisture Sensitivity Level (MSL):

2: Rated with a moisture sensitivity level of 2, this product can withstand moderate moisture exposure, ensuring long-term reliability in damp environments.

Interface IC Type:

HALF BRIDGE BASED PERIPHERAL DRIVER: Featuring a half-bridge based interface IC type, this peripheral driver delivers efficient power transmission, precise control, and reliable performance.

Turn-off Time:

6 us: With a turn-off time of 6 microseconds, this driver can swiftly halt current flow, contributing to improved responsiveness and accuracy.

Output Current Flow Direction:

SOURCE AND SINK: Supporting both source and sink output current flow directions, this peripheral driver offers versatility and compatibility with a wide range of peripheral devices.

Technical Specifications

Peripheral Drivers NCV7719DQR2G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G24

Length:

8.64 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

28 V

Minimum Supply Voltage-1:

5.5 V

Nominal Supply Voltage-1:

13.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

6 us

Turn-on Time:

13 us

Width:

3.9 mm

Trade Compliance

NCV7719DQR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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