Loading...

NCV7707DQBR2G

Onsemi

NCV7707DQBR2G by Onsemi

NCV7707DQBR2G by Onsemi is a half bridge peripheral driver with built-in protections for over voltage, thermal, and under voltage. It operates at supply voltages b/w 4.5V to 5.25V, making it suitable for automotive applications requiring reliable performance in harsh environments up to 150 °C. This small outline package with gull wing terminals has 36 terminals and is surface mountable for easy integration into compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 10,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,500

-

-

-

-

Vyrian

USA . 7,534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,534

-

-

-

-

Digiode

USA . 2,242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,242

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 950 parts In-Stock

1+ parts

$3.310

100+ parts

-

1k+ parts

-

10k+ parts

-

950

$3.310

-

-

-

AZTECH Wire

Italy . 1,144 parts In-Stock

1+ parts

$13.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,144

$13.350

-

-

-

Kulean Microsystems

USA . 8,229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,229

-

-

-

-

Problanco Electronics

Mexico . 7,508 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,508

-

-

-

-

SupplyDigital Components

Austria . 7,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,140

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

TANS Electronics

Latvia . 3,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,732

-

-

-

-

Corphita

USA . 1,899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,899

-

-

-

-

Kepictronics

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

UHIMA Technologies

Türkiye . 557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

557

-

-

-

-

Microchip USA

USA . 382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

382

-

-

-

-

Corohmni

South Africa . 316 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

316

-

-

-

-

Infinite Electronics LLP (Excess)

. 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19

-

-

-

-

Overview

Discover the unparalleled performance and reliability of the NCV7707DQBR2G by Onsemi, a cutting-edge peripheral driver designed to exceed your expectations. With built-in protections against overvoltage, thermal issues, and undervoltage, this automotive-grade component ensures peace of mind for your applications. Trust in Onsemi's reputation for quality and innovation as you experience the seamless operation and efficiency this product brings to your projects. Say goodbye to worries and hello to superior performance with the NCV7707DQBR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility and compatibility with a wide range of power sources.

Screening Level: AEC-Q100

AEC-Q100 screening ensures the product meets automotive-grade quality standards, making it reliable for automotive applications.

Built-in Protections: OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Built-in protections enhance the reliability and safety of the product by safeguarding against voltage spikes, overheating, and low voltage conditions.

No. of Terminals: 36

Having a higher number of terminals allows for greater connectivity options and versatility in circuit design.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures the product can withstand extreme conditions without performance degradation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the product to function reliably in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the product has a moderate level of moisture sensitivity, making it suitable for a wide range of environmental conditions.

Technical Specifications

Peripheral Drivers NCV7707DQBR2G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

8.4 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NCV7707DQBR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19