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NCV7608DWR2G

Onsemi

NCV7608DWR2G by Onsemi

NCV7608DWR2G by Onsemi is an AEC-Q100 compliant peripheral driver with 8-bit driver, 0.35A output current, and built-in protections for overcurrent and thermal issues. It operates b/w 3.15V to 5.25V, making it suitable for automotive applications requiring source and sink current flow control in a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Flip Electronics

USA . 75,000 parts In-Stock

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Vyrian

USA . 4,888 parts In-Stock

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4,888

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Chip Stock

USA . 3,092 parts In-Stock

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Digiode

USA . 214 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Semtec, LLC

USA . 33 parts In-Stock

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33

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 303 parts In-Stock

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$8.990

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303

$8.990

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AZTECH Wire

Italy . 798 parts In-Stock

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$12.402

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798

$12.402

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Semicontronic

India . 358 parts In-Stock

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$26.500

100+ parts

$25.838

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$25.705

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358

$26.500

$25.838

$25.705

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Ampacity Inc.

Singapore . 655 parts In-Stock

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$45.500

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655

$45.500

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Lixinc

USA . 9,938 parts In-Stock

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TANS Electronics

Latvia . 8,132 parts In-Stock

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SupplyDigital Components

Austria . 7,041 parts In-Stock

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Argo Parts USA

USA . 3,528 parts In-Stock

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Kulean Microsystems

USA . 1,629 parts In-Stock

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Continental Prestige Electronics

USA . 1,583 parts In-Stock

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Robosynatics

Brazil . 1,464 parts In-Stock

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Lucentia Tech

USA . 1,464 parts In-Stock

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$6.777

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$6.638

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$6.638

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$6.638

Kepictronics

USA . 1,333 parts In-Stock

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UHIMA Technologies

Türkiye . 781 parts In-Stock

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Problanco Electronics

Mexico . 329 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Corphita

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Corohmni

South Africa . 204 parts In-Stock

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Microchip USA

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Overview

Enhance the performance of your electronic devices with the NCV7608DWR2G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality peripheral drivers that offer reliable and efficient operation. Ideal for a wide range of applications, this product provides built-in protections against overcurrent and thermal issues, ensuring safety and durability. With a nominal supply voltage of 3.3V and a maximum output current of 0.35A, the NCV7608DWR2G is designed to meet your specific needs. Upgrade your electronics today with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Allows for easy installation on PCBs without the need for additional mounting hardware.

Maximum Supply Voltage: 5.25 V

Can handle high supply voltages, providing flexibility in power supply options.

Screening Level: AEC-Q100

Meets automotive quality standards, ensuring reliability in harsh operating environments.

Built-in Protections: OVER CURRENT; THERMAL

Offers protection against overcurrent and thermal issues, increasing the lifespan of the product.

Power Supplies (V): 3.5/5

Supports a range of power supply voltages, making it versatile for different applications.

No. of Terminals: 28

Provides multiple connection points for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the PCB and allows for efficient circuit layout.

Minimum Supply Voltage: 3.15 V

Can operate at lower voltages, saving energy and reducing heat generation.

Terminal Finish: MATTE TIN

Matte finish reduces glare and improves solderability during assembly.

Terminal Position: DUAL

Dual terminals provide redundancy and improve signal stability.

Maximum Seated Height: 2.65 mm

Low profile design fits in compact spaces and reduces overall height of the PCB.

Width: 7.5 mm

Narrow width saves space on the PCB and allows for efficient placement of other components.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures during solder reflow process without damage.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures reliable soldering and component connection.

Length: 17.925 mm

Optimal length for connecting to other components and fitting within the layout of the PCB.

Maximum Output Current: 0.35 A

Can handle high output currents, making it suitable for driving peripherals with varying power requirements.

Terminal Form: GULL WING

Gull wing terminals provide increased mechanical strength and ease of soldering.

Nominal Supply Voltage: 3.3 V

Stable supply voltage ensures consistent performance under varying load conditions.

Terminal Pitch: 1.27 mm

Optimal terminal spacing for easy connections and reduced chances of short circuits.

Driver No. of Bits: 8

8-bit driver allows for fine control and precise output signals for peripherals.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing environments.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface allows for easy integration with different types of peripherals and control systems.

Output Current Flow Direction: SOURCE AND SINK

Can source and sink current, providing bidirectional control for various types of peripherals.

Technical Specifications

Peripheral Drivers NCV7608DWR2G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.925 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Output Current Flow Direction:

SOURCE AND SINK

Maximum Output Current:

.35 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.5/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NCV7608DWR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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