Loading...

NBSG16VSMNR2G

Onsemi

NBSG16VSMNR2G by Onsemi

NBSG16VSMNR2G by Onsemi is a Line Transceiver with 16 terminals, operating at -40 to 85 °C. It features a max supply voltage of 3.465 V and max transmit delay of 0.18 ns. Ideal for industrial applications requiring differential input characteristics and differential output.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,859 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,859

-

-

-

-

Digiode

USA . 2,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,272

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 68 parts In-Stock

1+ parts

$21.220

100+ parts

-

1k+ parts

-

10k+ parts

-

68

$21.220

-

-

-

Component Stockers USA

USA . 209 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

209

$99.990

-

-

-

Kulean Microsystems

USA . 6,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,905

-

-

-

-

TANS Electronics

Latvia . 2,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,776

-

-

-

-

Problanco Electronics

Mexico . 2,316 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,316

-

-

-

-

UHIMA Technologies

Türkiye . 805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

805

-

-

-

-

Corphita

USA . 498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

498

-

-

-

-

SupplyDigital Components

Austria . 458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

458

-

-

-

-

Corohmni

South Africa . 230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

230

-

-

-

-

Microchip USA

USA . 225 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

225

-

-

-

-

Overview

Discover the power of seamless communication with the NBSG16VSMNR2G by Onsemi. As a leader in Line Drivers & Receivers, Onsemi delivers top-notch quality and reliability in all their products. Whether you're looking to enhance data transmission in industrial applications or ensure smooth signal reception in electronic devices, this surface mount device is the perfect solution. Benefit from precise performance, efficient power supplies, and a wide operating temperature range. Elevate your projects with the NBSG16VSMNR2G and experience unparalleled value and convenience.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for modern electronics manufacturing processes.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage ensures compatibility with a wide range of systems and applications.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for densely populated PCBs.

Maximum Transmit Delay: 0.18 ns

The low maximum transmit delay ensures fast signal transmission, crucial for high-speed data communication.

Power Supplies (V): +-2.5/+-3.3

Support for dual power supply voltages (+-2.5V and +-3.3V) increases flexibility in system design and integration.

No. of Terminals: 16

With 16 terminals, this product offers multiple connection points for enhanced signal routing and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides versatility in mounting and thermal management options.

Maximum High Level Input Current: 0.0001 Amp

The low maximum high-level input current helps in minimizing power consumption and heat dissipation.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures operational efficiency even in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range (-40 °C to 85°C) enables reliable performance in extreme environmental conditions.

Terminal Finish: NICKEL GOLD PALLADIUM

The use of nickel, gold, and palladium as terminal finish materials ensures excellent corrosion resistance and reliable electrical connections.

Terminal Position: QUAD

The quad terminal position enhances signal integrity and provides a secure connection for effective data transmission.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim and compact overall product profile, suitable for space-constrained applications.

Width: 3 mm

The narrow width of 3mm enables the product to be easily integrated into compact electronic designs.

Differential Output: YES

Differential output capability helps in reducing electromagnetic interference and improving signal quality over long transmission lines.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during PCB assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C supports lead-free soldering processes, complying with modern environmental regulations.

Length: 3 mm

The compact length of 3mm contributes to the overall small form factor of the product, ideal for miniaturized electronic applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures stable and reliable performance in harsh operating conditions typically found in industrial environments.

Maximum Receive Delay: 0.18 ns

The low maximum receive delay contributes to minimal signal distortion and ensures accurate data reception.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the PCB manufacturing process and eliminates the risk of lead-related environmental issues.

Input Characteristics: DIFFERENTIAL

The differential input characteristics enable noise immunity and improved signal integrity, crucial for high-performance data transmission.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V provides a standard operating reference for optimal performance and compatibility with industry standards.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density PCB layouts and facilitates efficient signal routing in limited space.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type enables bidirectional data communication between different systems or components, enhancing system connectivity.

Technical Specifications

Line Drivers & Receivers NBSG16VSMNR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.18 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.18 ns

Width:

3 mm

Trade Compliance

NBSG16VSMNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20