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NBSG16VSMNG

Onsemi

NBSG16VSMNG by Onsemi

NBSG16VSMNG by Onsemi is a Line Transceiver IC with differential input characteristics. It operates in industrial temperature grade range (-40 to 85 °C) and has a max supply voltage of 3.465 V. With a package style of CHIP CARRIER, it is suitable for applications requiring fast transmission speeds and precise signal timing.

Median Price

$35.032

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 17,002 parts In-Stock

1+ parts

-

100+ parts

$31.140

1k+ parts

$27.860

10k+ parts

$26.220

17,002

-

$31.140

$27.860

$26.220

Verical

USA . 5,352 parts In-Stock

1+ parts

-

100+ parts

$38.925

1k+ parts

$34.825

10k+ parts

$32.775

5,352

-

$38.925

$34.825

$32.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 962 parts In-Stock

1+ parts

$32.946

100+ parts

-

1k+ parts

-

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962

$32.946

-

-

-

DigiKey Marketplace

USA . 123 parts In-Stock

1+ parts

$36.070

100+ parts

-

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123

$36.070

-

-

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Vyrian

USA . 6,696 parts In-Stock

1+ parts

-

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6,696

-

-

-

-

Zilex Electronics Inc.

Canada . 42 parts In-Stock

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42

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Distributors (Availability)

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AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$19.250

100+ parts

-

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-

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565

$19.250

-

-

-

Ampacity Inc.

Singapore . 7,044 parts In-Stock

1+ parts

$29.480

100+ parts

-

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-

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7,044

$29.480

-

-

-

Corphita

USA . 1,232 parts In-Stock

1+ parts

$31.212

100+ parts

-

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1,232

$31.212

-

-

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Corohmni

South Africa . 409 parts In-Stock

1+ parts

$34.680

100+ parts

-

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-

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409

$34.680

-

-

-

Component Stockers USA

USA . 188 parts In-Stock

1+ parts

$35.800

100+ parts

$33.660

1k+ parts

$30.430

10k+ parts

$30.430

188

$35.800

$33.660

$30.430

$30.430

Kulean Microsystems

USA . 5,717 parts In-Stock

1+ parts

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5,717

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TANS Electronics

Latvia . 3,330 parts In-Stock

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3,330

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Problanco Electronics

Mexico . 2,180 parts In-Stock

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2,180

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RC Electronics

USA . 810 parts In-Stock

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810

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SupplyDigital Components

Austria . 592 parts In-Stock

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592

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Perfect Parts

USA . 245 parts In-Stock

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245

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Authorized Procurement Solutions

USA . 218 parts In-Stock

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218

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Microchip USA

USA . 134 parts In-Stock

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134

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Continental Prestige Electronics

USA . 123 parts In-Stock

1+ parts

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100+ parts

$28.310

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123

-

$28.310

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UHIMA Technologies

Türkiye . 35 parts In-Stock

1+ parts

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35

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Overview

Discover the exceptional quality and reliability of the NBSG16VSMNG line driver & receiver by Onsemi. Designed with precision and expertise, this surface-mount package offers maximum supply voltage of 3.465V and a compact square shape for seamless integration. Perfect for industrial applications, this product ensures fast transmit delay and differential output for efficient performance. Experience the value and benefits of Onsemi's cutting-edge technology with the NBSG16VSMNG, providing customers with reliable solutions for their electronic needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and compact integration onto circuit boards.

Maximum Supply Voltage: 3.465 V

Provides flexibility in power supply options.

Package Shape: SQUARE

Helps in efficient placement on the circuit board.

Maximum Transmit Delay: 0.18 ns

Ensures fast and reliable data transmission.

Power Supplies (V): +-2.5/+-3.3

Can accept a wide range of power supply voltages.

No. of Terminals: 16

Offers multiple connection points for versatility in applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides various options for different mounting preferences and space constraints.

Maximum High Level Input Current: 0.0001 Amp

Helps in reducing power consumption and heat generation.

Minimum Supply Voltage: 2.375 V

Ensures stable operation even at lower supply voltages.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Can withstand harsh cold temperatures.

Terminal Finish: NICKEL GOLD PALLADIUM

Provides corrosion resistance and reliable electrical connections.

Terminal Position: QUAD

Allows for secure and stable placement on the circuit board.

Maximum Seated Height: 1 mm

Enables low-profile and space-saving designs.

Width: 3 mm

Compact size for easy integration into tight spaces.

Differential Output: YES

Enables noise rejection and signal integrity in transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Ease of manufacturing and soldering process.

Peak Reflow Temperature °C: 260

Ensures reliable solder joints during assembly.

Length: 3 mm

Compact size for space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature ranges.

Maximum Receive Delay: 0.18 ns

Ensures fast response time for receiving data.

Terminal Form: NO LEAD

Lead-free construction for environmental friendliness.

Input Characteristics: DIFFERENTIAL

Provides noise immunity and signal integrity in data transmission.

Nominal Supply Voltage: 2.5 V

Optimal operating voltage for reliable performance.

Terminal Pitch: 0.5 mm

Offers fine pitch for compact and high-density circuit board designs.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for transmitting and receiving data signals over communication lines.

Technical Specifications

Line Drivers & Receivers NBSG16VSMNG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.18 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.18 ns

Width:

3 mm

Trade Compliance

NBSG16VSMNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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