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NBSG14MNR2

Onsemi

NBSG14MNR2 by Onsemi

NBSG14MNR2 by Onsemi is a Clock Driver & Buffer with 0.15 ns Propagation Delay, Differential Input Conditioning, and 2.5V Nominal Voltage. Ideal for high-speed applications requiring precise signal synchronization in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,709 parts In-Stock

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Digiode

USA . 2,423 parts In-Stock

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AZTECH Wire

Italy . 175 parts In-Stock

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$13.790

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175

$13.790

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Ampacity Inc.

Singapore . 261 parts In-Stock

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$57.000

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SupplyDigital Components

Austria . 6,876 parts In-Stock

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Corphita

USA . 1,880 parts In-Stock

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Kulean Microsystems

USA . 1,127 parts In-Stock

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Problanco Electronics

Mexico . 723 parts In-Stock

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723

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TANS Electronics

Latvia . 597 parts In-Stock

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Microchip USA

USA . 475 parts In-Stock

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UHIMA Technologies

Türkiye . 387 parts In-Stock

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Corohmni

South Africa . 341 parts In-Stock

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Overview

Elevate your designs with the NBSG14MNR2 from Onsemi, a leader in innovative semiconductor solutions. This exceptional clock driver offers lightning-fast performance with minimal propagation delay, ensuring precise timing for high-speed applications. Built for reliability within industrial environments, it’s perfect for data communications and networking. Trust Onsemi's commitment to quality and benefit from enhanced efficiency, lower power consumption, and superior thermal management, making it an invaluable asset for your projects.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.15 ns

This ultra-fast propagation delay ensures that the clock signal is delivered with minimal latency, making it ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier integration into densely packed circuit boards.

Input Conditioning: DIFFERENTIAL

Differential input conditioning provides noise immunity and enhances signal integrity, critical for high-frequency operations.

Package Shape: SQUARE

The square package shape contributes to efficient space utilization on PCBs, making it suitable for modern compact designs.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5V ensures compatibility with low-power applications while maintaining performance.

Power Supplies (V): -2.5/-3.3/2.5/3.3

Versatile power supply options allow for flexible system design in various applications, accommodating different voltage requirements.

No. of Terminals: 16

With 16 terminals, this device can connect to multiple signals, providing extensive functionality in a single component.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style is designed for effective thermal management, which is critical for maintaining performance in high-speed circuits.

Propagation Delay (tpd): 0.16 ns

Similar to the nominal supply delay, this low propagation delay ensures synchronous clock signal distribution, essential for high-frequency systems.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C makes this product suitable for industrial applications where heat dissipation is a concern.

Output Characteristics: SERIES-RESISTOR

Series-resistor output characteristics help in controlling output impedance, improving signal integrity during transmission.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this component is suitable for harsh environmental conditions, enhancing reliability.

Terminal Finish: TIN LEAD

Tin lead terminals provide excellent solderability and durability, ensuring long-term performance in various applications.

Terminal Position: QUAD

Quad terminal positioning allows for efficient wiring and integration into circuit layouts, simplifying PCB design.

Maximum Seated Height: 1 mm

A low seated height profile aids in space-constrained designs, making it a good option for compact electronic devices.

Width: 3 mm

A compact width of 3 mm facilitates easier placement on small PCBs, contributing to overall efficiency in design.

Minimum Supply Voltage (Vsup): 2.375 V

This minimum supply voltage allows for operation in low-power circuits, making the device suitable for battery-operated applications.

Peak Reflow Temperature °C: 235

The peak reflow temperature of 235 °C is compatible with standard soldering processes, ensuring ease of manufacturing.

Length: 3 mm

The compact length of 3 mm makes it suitable for high-density assembly, maximizing space efficiency on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures that the device functions reliably in demanding environments, enhancing longevity.

Technology: ECL

Emitter Coupled Logic (ECL) technology provides high-speed operation, making this product ideal for advanced computing applications.

Terminal Form: NO LEAD

No-lead form factor enables excellent thermal performance and minimizes space usage, suitable for modern electronic designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense terminal arrangements, which is advantageous for compact designs.

Maximum Same Edge Skew (tskwd): 0.015 ns

This low skew value signifies high precision in clock signal delivery, which is crucial for synchronous systems.

No. of True Outputs: 4

Having 4 true outputs provides flexibility in application designs, allowing for diverse functionalities in a single chip.

Minimum fmax: 10500 MHz

A minimum maximum frequency of 10,500 MHz makes this device suitable for high-frequency applications, ensuring optimal performance.

Maximum Supply Voltage (Vsup): 3.465 V

This upper voltage limit provides design flexibility, allowing for higher performance levels when needed.

Technical Specifications

Clock Drivers & Buffers NBSG14MNR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

RSNECL MODE: VCC = 0 V WITH VEE = -2.375 V TO -3.465 V

Family:

14

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

SERIES-RESISTOR

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.16 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

10500 MHz

Trade Compliance

NBSG14MNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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