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NB6L572MMNR4G

Onsemi

NB6L572MMNR4G by Onsemi

NB6L572MMNR4G clock driver by Onsemi has a propagation delay of 10ns, operates at 2.5V, and offers differential mux input conditioning. It is ideal for applications requiring precise timing control in industrial settings due to its high frequency capabilities up to 5000MHz.

Median Price

$9.238

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 696 parts In-Stock

1+ parts

$13.070

100+ parts

$8.830

1k+ parts

$8.246

10k+ parts

-

696

$13.070

$8.830

$8.246

-

Rochester

USA . 2,057 parts In-Stock

1+ parts

-

100+ parts

$7.400

1k+ parts

$6.620

10k+ parts

$6.230

2,057

-

$7.400

$6.620

$6.230

Verical

USA . 2,057 parts In-Stock

1+ parts

-

100+ parts

$9.238

1k+ parts

$8.262

10k+ parts

$7.775

2,057

-

$9.238

$8.262

$7.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,024 parts In-Stock

1+ parts

$7.818

100+ parts

-

1k+ parts

-

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2,024

$7.818

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-

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Vyrian

USA . 4,701 parts In-Stock

1+ parts

-

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4,701

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Martec Srl

Italy . 2,000 parts In-Stock

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2,000

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-

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Flip Electronics

USA . 683 parts In-Stock

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683

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 361 parts In-Stock

1+ parts

$6.220

100+ parts

-

1k+ parts

-

10k+ parts

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361

$6.220

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-

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Corphita

USA . 1,314 parts In-Stock

1+ parts

$7.407

100+ parts

-

1k+ parts

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1,314

$7.407

-

-

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Microchip USA

USA . 3,348 parts In-Stock

1+ parts

$23.380

100+ parts

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3,348

$23.380

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Problanco Electronics

Mexico . 7,551 parts In-Stock

1+ parts

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7,551

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TANS Electronics

Latvia . 6,469 parts In-Stock

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6,469

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SupplyDigital Components

Austria . 2,649 parts In-Stock

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2,649

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Continental Prestige Electronics

USA . 2,057 parts In-Stock

1+ parts

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2,057

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Kulean Microsystems

USA . 851 parts In-Stock

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851

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UHIMA Technologies

Türkiye . 151 parts In-Stock

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151

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Overview

Enhance your electronic designs with the NB6L572MMNR4G by Onsemi, a high-quality clock driver and buffer that offers precision timing solutions for your applications. Onsemi is a trusted manufacturer known for delivering reliable components, and this product is no exception. With a fast propagation delay, differential input conditioning, and a wide operating temperature range, this chip carrier offers exceptional performance in a compact package. Upgrade your projects with the NB6L572MMNR4G and experience improved signal integrity and synchronization. Elevate your designs with this versatile component from Onsemi today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 10 ns

With a fast propagation delay, this clock driver ensures efficient data transmission within the specified time frame.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs.

Package Shape: SQUARE

The square package shape offers a standardized form factor for compatibility with various design layouts.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a typical supply voltage of 2.5V, this clock driver is suitable for low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this clock driver can withstand elevated environmental conditions.

Technical Specifications

Clock Drivers & Buffers NB6L572MMNR4G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3 V

Family:

6L

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

5000 MHz

Trade Compliance

NB6L572MMNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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