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NB6L572MMNG

Onsemi

NB6L572MMNG by Onsemi

NB6L572MMNG clock driver by Onsemi features a propagation delay of 10ns, operates at 2.5V, and has a terminal pitch of 0.5mm. It is used in applications requiring differential mux input conditioning and offers a max operating temperature of 85°C.

Median Price

$13.445

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 145 parts In-Stock

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$12.560

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$10.930

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DigiKey

USA . 3 parts In-Stock

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$14.330

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3

$14.330

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Digiode

USA . 1,624 parts In-Stock

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$11.932

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$11.932

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Vyrian

USA . 12,794 parts In-Stock

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Flip Electronics

USA . 888 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 74 parts In-Stock

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$10.680

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74

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Corphita

USA . 1,210 parts In-Stock

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$11.304

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Component Stockers USA

USA . 319 parts In-Stock

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$12.360

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$10.910

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319

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Corohmni

South Africa . 382 parts In-Stock

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$12.560

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382

$12.560

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Microchip USA

USA . 2,605 parts In-Stock

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$36.900

100+ parts

$36.380

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$36.110

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$35.850

2,605

$36.900

$36.380

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$35.850

Lixinc

USA . 6,334 parts In-Stock

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SupplyDigital Components

Austria . 5,402 parts In-Stock

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Problanco Electronics

Mexico . 4,303 parts In-Stock

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TANS Electronics

Latvia . 4,255 parts In-Stock

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Kulean Microsystems

USA . 3,506 parts In-Stock

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UHIMA Technologies

Türkiye . 909 parts In-Stock

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Perfect Parts

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Overview

Experience the power of precision with the NB6L572MMNG clock driver by Onsemi. Designed for optimal performance, this innovative product offers unparalleled quality and reliability. Ideal for a wide range of applications in clock drivers and buffers, this chip carrier boasts a quick propagation delay of 0.25 ns, ensuring seamless operation. With a nominal supply voltage of 2.5V and a maximum operating temperature of 85°C, this device is perfect for industrial use. Trust Onsemi to deliver excellence with the NB6L572MMNG, providing customers with unmatched value and efficiency in their electronic projects.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay ensures fast and efficient operation of the clock driver.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning enables versatile signal handling capabilities.

Nominal Supply Voltage: 2.5V

Operates at a common and stable supply voltage for compatibility in various applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environment conditions.

Technical Specifications

Clock Drivers & Buffers NB6L572MMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3 V

Family:

6L

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

5000 MHz

Trade Compliance

NB6L572MMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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