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NB6L239MNR2

Onsemi

NB6L239MNR2 by Onsemi

NB6L239MNR2 by Onsemi is a Clock Driver with 0.6 ns Propagation Delay, 2.5V Nominal Voltage, and 3000 MHz Min fmax. Ideal for applications requiring high-speed signal transmission in industrial settings due to its ECL technology and differential input conditioning.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 10,066 parts In-Stock

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Cyclops Electronics Ltd

UK . 5,188 parts In-Stock

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Digiode

USA . 986 parts In-Stock

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AZTECH Wire

Italy . 943 parts In-Stock

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$13.250

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Authorized Procurement Solutions

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RC Electronics

USA . 7,779 parts In-Stock

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Kulean Microsystems

USA . 3,965 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,948 parts In-Stock

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Problanco Electronics

Mexico . 2,938 parts In-Stock

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SupplyDigital Components

Austria . 946 parts In-Stock

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TANS Electronics

Latvia . 756 parts In-Stock

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Futuretech Components

Singapore . 707 parts In-Stock

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UHIMA Technologies

Türkiye . 554 parts In-Stock

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Corohmni

South Africa . 474 parts In-Stock

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Microchip USA

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Corphita

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Overview

Enhance your clock driver and buffer systems with the NB6L239MNR2 by Onsemi, a top-quality solution for your timing needs. With a minimal propagation delay of 0.6 ns and differential input conditioning, this product offers unparalleled performance in clock distribution applications. Manufactured by industry leader Onsemi, known for their cutting-edge technology and reliability, this clock driver provides precise timing control with its advanced ECL technology. Say goodbye to timing inaccuracies and hello to seamless synchronization with the NB6L239MNR2. Experience the superior value and benefits this product brings to your operations.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.6 ns

Low propagation delay ensures accurate and efficient clock distribution in high-speed applications.

Surface Mount: YES

Surface mount technology enables easy and reliable assembly onto circuit boards.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing signal noise and improving signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

Compatible with common 2.5V supply voltages used in many electronic systems.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation, suitable for industrial environments.

Technical Specifications

Clock Drivers & Buffers NB6L239MNR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.6 ns

Propagation Delay (tpd):

.57 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

3000 MHz

Trade Compliance

NB6L239MNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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