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NB6L239MN

Onsemi

NB6L239MN by Onsemi

NB6L239MN by Onsemi is a Clock Driver with 0.6 ns Propagation Delay, 2.5V Nominal Voltage, and 3000 MHz Min fmax. Ideal for applications requiring high-speed signal synchronization in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

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Vyrian

USA . 4,704 parts In-Stock

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Digiode

USA . 470 parts In-Stock

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R&J Components

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Prism Electronics

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AZTECH Wire

Italy . 1,015 parts In-Stock

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$12.590

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Ampacity Inc.

Singapore . 1,493 parts In-Stock

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SupplyDigital Components

Austria . 3,908 parts In-Stock

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TANS Electronics

Latvia . 3,674 parts In-Stock

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Kulean Microsystems

USA . 2,377 parts In-Stock

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Problanco Electronics

Mexico . 1,018 parts In-Stock

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Corohmni

South Africa . 478 parts In-Stock

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Microchip USA

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Overview

Enhance the performance of your electronic devices with the NB6L239MN clock driver and buffer by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that meet the highest standards. Ideal for applications requiring precise timing, this chip carrier offers a fast propagation delay of just 0.6 ns at a nominal supply voltage of 2.5V, ensuring reliable operation in industrial settings. With differential input conditioning and two true outputs, the NB6L239MN provides exceptional value and efficiency for your design needs. Boost your product's performance with Onsemi's innovative clock driver and buffer technology.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.6 ns

Low propagation delay ensures accurate timing signals, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving in electronic circuit designs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning ensures high noise immunity and reliable signal transmission.

Nominal Supply Voltage / Vsup (V): 2.5

Works efficiently with a commonly used supply voltage of 2.5V, making it compatible with various systems.

Minimum Supply Voltage (Vsup): 2.375 V

Can operate reliably even at lower supply voltages, providing flexibility in power supply options.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher operating temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Can operate in harsh cold environments, ensuring reliable performance in diverse conditions.

Technology: ECL

Utilizes ECL technology known for high speed and low power consumption, making it ideal for demanding applications.

Minimum fmax: 3000 MHz

High maximum clock frequency allows for high-speed data processing, making this product suitable for advanced electronic systems.

Technical Specifications

Clock Drivers & Buffers NB6L239MN attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.6 ns

Propagation Delay (tpd):

.57 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

3000 MHz

Trade Compliance

NB6L239MN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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