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MTP23P06VG

Onsemi

MTP23P06VG by Onsemi

MTP23P06VG by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, 81A IDM, and 0.12 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with 175°C max temp. It has a built-in DIODE, 794mJ EAS rating, and comes in RECTANGULAR package style.

Median Price

$0.921

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22 parts In-Stock

1+ parts

$0.921

100+ parts

$0.866

1k+ parts

$0.783

10k+ parts

$0.783

22

$0.921

$0.866

$0.783

$0.783

Distributors (In-Stock)

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Freelance Electronics

USA . 2 parts In-Stock

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$0.716

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$0.716

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Digiode

USA . 175 parts In-Stock

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$0.875

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$0.875

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Nova Conductors

Japan . 700 parts In-Stock

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$0.885

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$0.885

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Legend Electronics Inc.

USA . 19,130 parts In-Stock

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Vyrian

USA . 4,558 parts In-Stock

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Lantek

USA . 394 parts In-Stock

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QIE Inc.

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ComSIT Distribution GmbH

Germany . 42 parts In-Stock

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ComSIT USA

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Pegasus Components GmbH

Germany . 40 parts In-Stock

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Inventory MP

USA . 21 parts In-Stock

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Bristol Electronics

USA . 21 parts In-Stock

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LittleDiode

UK . 3 parts In-Stock

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Electronics Depot

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Distributors (Availability)

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Corohmni

South Africa . 338 parts In-Stock

1+ parts

$0.716

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338

$0.716

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Ampacity Inc.

Singapore . 22 parts In-Stock

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$0.780

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$0.780

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Corphita

USA . 1,703 parts In-Stock

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$0.829

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$0.829

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Argo Parts USA

USA . 832 parts In-Stock

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$0.885

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Netroflash

USA . 50 parts In-Stock

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$0.885

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$0.867

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$0.885

$0.867

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Semicontronic

India . 22 parts In-Stock

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$1.700

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$1.658

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$1.649

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$1.700

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AZTECH Wire

Italy . 532 parts In-Stock

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$12.308

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Kepictronics

USA . 15,000 parts In-Stock

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Kulean Microsystems

USA . 4,905 parts In-Stock

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Problanco Electronics

Mexico . 4,599 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 2,236 parts In-Stock

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SupplyDigital Components

Austria . 1,705 parts In-Stock

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Continental Prestige Electronics

USA . 716 parts In-Stock

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$0.805

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UHIMA Technologies

Türkiye . 594 parts In-Stock

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GreenTree Electronics

Israel . 394 parts In-Stock

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Overview

Unlock the power of high-quality performance with the MTP23P06VG by Onsemi. This P-channel Power Field Effect Transistor boasts a single configuration with a built-in diode, making it ideal for switching applications. With a minimum DS breakdown voltage of 60V and a maximum drain current of 23A, this transistor offers unmatched reliability and efficiency. Whether you're looking to enhance your system's performance or improve energy efficiency, the MTP23P06VG delivers exceptional value and benefits that will elevate your project to new heights. Trust Onsemi's expertise and innovation to bring you cutting-edge solutions for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

Suitable for use in various switching applications, offering versatility in different circuit configurations.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with integrated diode for easier circuit integration and improved efficiency.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring reliable performance in controlling electrical signals.

Minimum DS Breakdown Voltage: 60 V

Capable of handling high voltages, making it suitable for a wide range of power applications.

Maximum Power Dissipation (Abs): 90 W

Can handle high power dissipation, allowing for efficient operation even under heavy load conditions.

Maximum Operating Temperature: 175 °C

Capable of operating at high temperatures without compromising performance, ensuring stability in various environments.

Technical Specifications

Power Field Effect Transistors (FET) MTP23P06VG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

794 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

81 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP23P06VG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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