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MTP20N20E

Onsemi

MTP20N20E by Onsemi

MTP20N20E by Onsemi is a N-CHANNEL FET with 200V DS Breakdown Voltage, 60A IDM, and 0.16 ohm RDS(on). Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE at up to 150 °C, making it suitable for high-power tasks.

Median Price

$10.000

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TEDSS.com

USA . 50 parts In-Stock

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$10.000

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$2.000

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50

$10.000

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Digiode

USA . 2,064 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,300 parts In-Stock

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1,300

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Electronics Depot

USA . 505 parts In-Stock

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505

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ComSIT Distribution GmbH

Germany . 434 parts In-Stock

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434

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Vyrian

USA . 232 parts In-Stock

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R&J Components

USA . 50 parts In-Stock

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Prism Electronics

USA . 12 parts In-Stock

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LittleDiode

UK . 6 parts In-Stock

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GES GmbH

Germany . 5 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 208 parts In-Stock

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$10.000

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Kepictronics

USA . 13,000 parts In-Stock

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Kulean Microsystems

USA . 8,322 parts In-Stock

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SupplyDigital Components

Austria . 6,619 parts In-Stock

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Problanco Electronics

Mexico . 4,850 parts In-Stock

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TANS Electronics

Latvia . 4,682 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Perfect Parts

USA . 2,925 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,300 parts In-Stock

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Glotronic Ltd.

UK . 1,040 parts In-Stock

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Corphita

USA . 715 parts In-Stock

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715

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UHIMA Technologies

Türkiye . 85 parts In-Stock

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85

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Overview

Discover unparalleled performance and reliability with the MTP20N20E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality Power Field Effect Transistors (FET) that are perfect for a wide range of switching applications. With a maximum power dissipation of 125W and an enhanced mode of operation, this N-CHANNEL transistor offers exceptional value and efficiency. Whether you are designing industrial equipment or automotive systems, the MTP20N20E provides the ultimate solution for your power management needs. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring longevity and reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, making this product a good choice for high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse current flow, enhancing the overall functionality of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and efficient operation in various electronic circuits.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this FET can withstand higher voltages without breakdown, making it suitable for demanding applications with variable voltage levels.

Maximum Drain Current (ID): 20 A

This high drain current rating allows the FET to handle large current loads without overheating, making it ideal for power-intensive applications.

Maximum Power Dissipation (Abs): 125 W

The high power dissipation capability of this FET ensures efficient heat dissipation, enabling continuous operation in high-power environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved efficiency and performance characteristics, making this FET a reliable choice for various electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) MTP20N20E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

600 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP20N20E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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