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MTP2955V

Onsemi

MTP2955V by Onsemi

The Onsemi MTP2955V is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 42A and EAS of 216mJ, making it suitable for high-power operations. With a low 0.23 ohm RDS(on), this transistor offers efficient performance in ENHANCEMENT MODE operation.

Median Price

$2.296

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 17 parts In-Stock

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$2.296

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$2.411

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$2.273

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Digiode

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Odintec Ltd.

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LIBRA Elektronik GmbH

Germany . 150 parts In-Stock

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Lakeland Logistics Inc

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Bristol Electronics

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Legend Electronics Inc.

USA . 32 parts In-Stock

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Prism Electronics

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Electronics Depot

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LittleDiode

UK . 10 parts In-Stock

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MRC Electronics

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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NAC Semi

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Corohmni

South Africa . 283 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

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SupplyDigital Components

Austria . 4,762 parts In-Stock

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Kulean Microsystems

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TANS Electronics

Latvia . 1,788 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,515 parts In-Stock

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Assy Fe

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UHIMA Technologies

Türkiye . 306 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Overview

Experience the power and reliability of the MTP2955V by Onsemi, a top-quality P-CHANNEL Power Field Effect Transistor designed for switching applications. With a maximum drain current of 12A and an enhanced mode operation, this transistor offers unparalleled performance and efficiency. Onsemi's commitment to excellence ensures that this transistor delivers exceptional value and benefits to customers seeking reliable and high-performing components. Upgrade your electronic devices with the MTP2955V and experience the difference in quality and performance today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components, increasing the lifespan of the product.

Polarity or Channel Type: P-CHANNEL

P-channel FETs have lower on-resistance compared to N-channel FETs, making them efficient for certain applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode prevents reverse polarity damage, improving the overall reliability of the product.

Transistor Application: SWITCHING

Switching applications require fast response times and low power dissipation, which this FET can provide efficiently.

Minimum DS Breakdown Voltage: 60 V

Higher breakdown voltage provides better protection against voltage spikes and overloads.

Maximum Pulsed Drain Current (IDM): 42 A

High pulsed drain current allows the FET to handle sudden power surges effectively.

Maximum Power Dissipation (Abs): 60 W

Higher power dissipation capability means the FET can handle higher loads without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance for efficient operation.

Maximum Operating Temperature: 175 °C

Higher operating temperature range allows the FET to function in various environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) MTP2955V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

216 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.23 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

42 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP2955V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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