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MTP2P50E

Onsemi

MTP2P50E by Onsemi

The Onsemi MTP2P50E is a P-CHANNEL Power FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 6A, EAS of 80mJ, and ID of 2A. Operating in ENHANCEMENT MODE, it has a max power dissipation of 75W at 150°C.

Median Price

$4.620

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 22 parts In-Stock

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$4.620

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$3.460

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Vyrian

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Digiode

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Chip Stock

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Nova Conductors

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Contempo Components LLC

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Resion

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Atlantic Semiconductor

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Bristol Electronics

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Speed Components Ltd

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Prism Electronics

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J & M Industries LLC

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ACDS - Activité Composants Distribution Service

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Sea View Technologies

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Semi Source

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ComSIT Distribution GmbH

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Carlin Systems, Inc.

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Sogenti Electronics

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First Choice Components Inc.

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Inventory MP

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Component Sense

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LittleDiode

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Corohmni

South Africa . 25 parts In-Stock

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$0.389

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$0.397

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$0.397

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Ampacity Inc.

Singapore . 1,013 parts In-Stock

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$5.050

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AZTECH Wire

Italy . 798 parts In-Stock

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$15.849

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Andel Nordic

Denmark . 3,191 parts In-Stock

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$51.230

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$35.858

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Component Stockers USA

USA . 371 parts In-Stock

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$99.990

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Kepictronics

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Problanco Electronics

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TANS Electronics

Latvia . 6,823 parts In-Stock

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Kulean Microsystems

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Argo Parts USA

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SupplyDigital Components

Austria . 2,784 parts In-Stock

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Lixinc

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Corphita

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UHIMA Technologies

Türkiye . 550 parts In-Stock

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S.R.D Solutions

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Bastille Electronics

Australia . 300 parts In-Stock

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Perfect Parts

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Computer Components Inc. - USA

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Cyclops Electronics Ltd (Excess)

UK . 36 parts In-Stock

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Glotronic Ltd.

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Overview

Unleash the power of cutting-edge technology with the MTP2P50E by Onsemi. This P-channel Power FET boasts superior quality and reliability, making it the go-to choice for switching applications. With a maximum operating temperature of 150°C and a minimum DS breakdown voltage of 500V, this transistor offers unmatched performance and durability. Whether you're in need of enhanced efficiency or increased power dissipation, the MTP2P50E delivers on all fronts. Upgrade your systems today with Onsemi's innovative solution and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable package for the transistor, making it suitable for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs have advantages such as lower on-resistance and higher current capability compared to N-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier and more efficient circuit design and implementation.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in high-frequency switching circuits.

Minimum DS Breakdown Voltage: 500 V

Provides a high level of breakdown voltage, allowing for use in high voltage applications.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and fit in various electronic devices or circuits.

Maximum Pulsed Drain Current (IDM): 6 A

Capable of handling high pulsed drain currents, suitable for applications requiring short bursts of power.

Avalanche Energy Rating (EAS): 80 mJ

With a high avalanche energy rating, this FET can withstand voltage spikes and surges without damage.

Maximum Drain Current (Abs) (ID): 2 A

Ability to handle up to 2A of continuous drain current, suitable for medium power applications.

Maximum Power Dissipation (Abs): 75 W

With a high power dissipation rating, this FET can handle significant power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Uses MOSFET technology, known for high switching speeds, low on-resistance, and low gate drive power.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures, suitable for applications where heat dissipation is a concern.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides good solderability and ensures reliable electrical connections.

Maximum Drain-Source On Resistance: 6 ohm

Low on-resistance helps minimize power loss and improve efficiency in the circuit.

Peak Reflow Temperature °C: 235

Can withstand high-temperature reflow soldering processes, making it suitable for automated assembly.

Technical Specifications

Power Field Effect Transistors (FET) MTP2P50E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

HIGH VOLTAGE

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

6 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP2P50E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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