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MTP23P06V

Onsemi

MTP23P06V by Onsemi

MTP23P06V by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage and 81A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and 0.12 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 90W and can withstand temperatures up to 175°C.

Median Price

$9.020

Lifecycle Status

Suppliers In-Stock

17

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American Microsemiconductor Inc.

USA . 70 parts In-Stock

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Legend Electronics Inc.

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Vyrian

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Digiode

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Pegasus Components GmbH

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ComSIT Distribution GmbH

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MRC Electronics

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Nova Conductors

Japan . 100 parts In-Stock

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LWI Electronics Inc

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Ashlea Components Ltd

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Electronic Expediters

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Mil-Aero Solutions, Inc.

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LittleDiode

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MISTER SPROCKETS

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A2Z Electronics, Inc.

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PC Components Company LLC

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Bristol Electronics

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Corohmni

South Africa . 194 parts In-Stock

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AZTECH Wire

Italy . 683 parts In-Stock

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$9.544

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Ampacity Inc.

Singapore . 382 parts In-Stock

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$15.050

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Semicontronic

India . 1,164 parts In-Stock

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$35.149

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Kepictronics

USA . 15,000 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

Germany . 7,079 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 2,849 parts In-Stock

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Argo Parts USA

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SupplyDigital Components

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Continental Prestige Electronics

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UHIMA Technologies

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Corphita

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Bastille Electronics

Australia . 500 parts In-Stock

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Perfect Parts

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Montclair Electronics, Inc.

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Overview

Enhance your power switching applications with the MTP23P06V by Onsemi. This P-Channel Power Field Effect Transistor offers high-quality performance and reliability, making it the ideal choice for various industrial and consumer electronics. With a maximum drain current of 23A and a minimum DS breakdown voltage of 60V, this transistor provides efficient switching capabilities. Trust in Onsemi's expertise in semiconductor technology to deliver superior products that meet your power management needs. Upgrade to the MTP23P06V today and experience the benefits of enhanced power efficiency and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and impact resistance, making this transistor suitable for a variety of environments.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low input capacitance and high input impedance, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing the overall functionality of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and fast switching speeds.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60 V, this transistor can handle high voltages, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 90 W

The high power dissipation rating of 90 W allows this transistor to handle large amounts of power without overheating, ensuring reliable performance.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand high-temperature environments, making it ideal for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) MTP23P06V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

794 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

81 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP23P06V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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