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MTP2955VG

Onsemi

MTP2955VG by Onsemi

MTP2955VG by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage and 42A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and 0.23 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 60W and can withstand temperatures up to 175 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,275 parts In-Stock

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Vyrian

USA . 508 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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Problanco Electronics

Mexico . 3,720 parts In-Stock

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TANS Electronics

Latvia . 3,151 parts In-Stock

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SupplyDigital Components

Austria . 2,248 parts In-Stock

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Corphita

USA . 1,542 parts In-Stock

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UHIMA Technologies

Türkiye . 803 parts In-Stock

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Kulean Microsystems

USA . 396 parts In-Stock

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Corohmni

South Africa . 362 parts In-Stock

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Overview

Enhance your power switching applications with the MTP2955VG by Onsemi. This high-quality P-Channel Power Field Effect Transistor offers reliable performance and efficiency, making it ideal for a wide range of switching tasks. With a maximum pulsing drain current of 42A and an avalanche energy rating of 216mJ, this transistor delivers impressive power capabilities. Choose the MTP2955VG for your projects and experience the value and benefits of Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, making it suitable for various industrial applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are often used in power management applications and can offer lower resistance and higher current-handling capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode can simplify circuit design and protect the transistor from voltage spikes, enhancing the reliability of the overall system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of power in various electronic devices.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltages without breakdown, making it suitable for high-power applications.

Maximum Pulsed Drain Current (IDM): 42 A

With a high pulsed drain current rating, this FET can handle short bursts of high current, making it suitable for applications that require peak power handling.

Maximum Power Dissipation (Abs): 60 W

This FET can dissipate up to 60W of power, making it suitable for applications where heat dissipation is crucial for reliable operation.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand elevated temperatures, making it suitable for industrial environments.

Technical Specifications

Power Field Effect Transistors (FET) MTP2955VG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

216 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.23 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

42 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP2955VG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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