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MTP25N06E

Onsemi

MTP25N06E by Onsemi

MTP25N06E by Onsemi is a N-CHANNEL FET with 25A ID and 100W power dissipation. Ideal for enhancement mode applications, it operates at up to 150 °C. Suitable for various power electronics projects due to its high current handling capabilities.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

MTP25N06E by Onsemi
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Vyrian

USA . 2,049 parts In-Stock

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Digiode

USA . 1,157 parts In-Stock

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R&J Components

USA . 16 parts In-Stock

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Kulean Microsystems

USA . 7,223 parts In-Stock

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Problanco Electronics

Mexico . 5,876 parts In-Stock

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TANS Electronics

Latvia . 2,924 parts In-Stock

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SupplyDigital Components

Austria . 2,818 parts In-Stock

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Corphita

USA . 1,230 parts In-Stock

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UHIMA Technologies

Türkiye . 719 parts In-Stock

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Corohmni

South Africa . 366 parts In-Stock

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Overview

The MTP25N06E by Onsemi is a top-tier Power Field Effect Transistor (FET) that stands out for its exceptional quality and performance. Onsemi is renowned for its cutting-edge technology and innovation, ensuring that this N-CHANNEL FET delivers superior results in various applications. With a maximum drain current of 25A and a maximum power dissipation of 100W, this enhancement mode transistor offers unparalleled reliability and efficiency. Whether you're looking to boost the power in your electronic devices or enhance the performance of your circuits, the MTP25N06E provides unmatched value and benefits that will exceed your expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are known for their high efficiency and low on-resistance, making this product ideal for power applications.

Configuration: SINGLE

The single configuration simplifies circuit design and makes installation easier, reducing overall system complexity.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor, providing flexibility in various applications.

Maximum Drain Current (ID): 25 A

With a high maximum drain current, this FET can handle heavy loads and is suitable for high-power applications.

Maximum Power Dissipation: 100 W

The high power dissipation rating ensures the FET can operate at high power levels without the risk of overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides reliability and stability, making this FET a dependable choice for power applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable performance in demanding environmental conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures good solderability and interconnection with other components, enhancing overall product reliability.

Technical Specifications

Power Field Effect Transistors (FET) MTP25N06E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e0

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Trade Compliance

MTP25N06E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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