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MTP2N60E

Onsemi

MTP2N60E by Onsemi

MTP2N60E by Onsemi is a N-CHANNEL FET with 600V DS breakdown voltage, 9A IDM, and 190mJ EAS. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 50W.

Median Price

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Lifecycle Status

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Vyrian

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Legend Electronics Inc.

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Digiode

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PC Components Company LLC

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Bristol Electronics

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Pegasus Components GmbH

Germany . 390 parts In-Stock

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Classic Components Corporation

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Connector Distribution Corp

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Right Parts Inc.

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Electronics Depot

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Kepictronics

USA . 13,000 parts In-Stock

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TANS Electronics

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Kulean Microsystems

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SupplyDigital Components

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UHIMA Technologies

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Overview

Unlock the power of efficiency and reliability with the MTP2N60E by Onsemi. Crafted with precision and quality in mind, this N-CHANNEL Power Field Effect Transistor offers seamless switching capabilities for a wide range of applications. With a remarkable 600V minimum DS Breakdown Voltage and 190mJ Avalanche Energy Rating, this transistor ensures optimal performance and durability. Whether you're in need of a robust solution for your enhancement mode applications or seeking a trusted partner for your projects, the MTP2N60E delivers unbeatable value and benefits that will take your designs to the next level. Trust in Onsemi for cutting-edge technology and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection, making the FET durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher conductivity, making them more efficient.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode provides reverse polarity protection and simplifies circuit design.

Transistor Application: SWITCHING

Designed for efficient switching applications, making it suitable for various power control purposes.

Minimum DS Breakdown Voltage: 600 V

High breakdown voltage allows it to handle higher voltages without breakdown, ensuring safety and reliability.

Package Shape: RECTANGULAR

Rectangular shape helps in easy mounting and integration into circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to use in most applications and provide better control.

Maximum Pulsed Drain Current (IDM): 9 A

High maximum pulsed drain current allows for handling sudden power surges without damage.

Avalanche Energy Rating (EAS): 190 mJ

High avalanche energy rating ensures the FET can withstand voltage spikes and surges.

Maximum Drain Current (Abs) (ID): 2 A

Sufficient maximum drain current for various applications.

Maximum Power Dissipation (Abs): 50 W

High power dissipation capability allows the FET to handle high power loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows the FET to operate in a wide range of environments.

Transistor Element Material: SILICON

Silicon-based element provides good performance and reliability.

Terminal Finish: TIN LEAD

Tin lead finish ensures good conductivity and corrosion resistance for terminals.

Maximum Drain-Source On Resistance: 3.8 ohm

Low ON resistance minimizes power loss and improves efficiency.

Terminal Position: SINGLE

Single terminal position simplifies circuit connections.

Case Connection: DRAIN

Drain connection allows for easy integration into circuits.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures proper soldering during manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) MTP2N60E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

190 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

3.8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

9 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP2N60E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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